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Aluminium nitride ceramic support

A technology of aluminum nitride ceramics and bosses, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor thermal conductivity, low luminous flux, and poor heat dissipation, so as to improve the heat dissipation effect and the overall structure is firm , good thermal conductivity

Inactive Publication Date: 2018-05-25
SHENGNUO OPTOELECTRONICS TECH QH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide an aluminum nitride ceramic bracket to solve the problems of poor heat dissipation, low luminous flux, poor light efficiency and poor thermal conductivity mentioned in the above background technology

Method used

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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0015] See Figure 1-3 , The present invention provides a technical solution: an aluminum nitride ceramic bracket, including a die-bonding tank 1, a boss 2, a heat dissipation hole 3, a positive electrode welding plate 4, a retaining wall structure 5, a substrate 6, a body 7, and a negative electrode The welding plate 8, the positioning hole 9, the ceramic welding plate 10, the silver layer 11, the accommodating space 12, the thermally c...

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Abstract

The invention discloses an aluminium nitride ceramic support. The aluminium nitride ceramic support includes a solid crystal groove, a silver layer, an accommodating space, a heat conduction chip anda refrigeration sheet. A body is fixedly provided with a boss on the internal side thereof, and a negative electrode welding plate is fixed on the top of the bevel of the boss. A positive electrode welding plate is fixedly on the bottom of the boss in an inclined direction, and the surface of the boss is provided with an accommodating space. A retaining wall structure is fixedly provided with thesolid crystal groove in the periphery thereof, and the retaining wall structure is provided with a positioning hole thereabove. Two sides of the boss are fixedly provided with a heat dissipation hole.The boss and the body are connected through a substrate. The silver layer is fixedly provided with a ceramic welding plate thereon. The refrigeration sheet is provided with the heat conduction chip thereabove, and the heat conduction chip is provided with the accommodating space thereabove. The aluminium nitride ceramic support effectively increases the heat dissipation effects of products by fixedly installing heat dissipation holes on two sides of the boss, and is conducive to the acceleration of heat conduction and the increase of heat dissipation effects by configuring the refrigeration sheet. The aluminium nitride ceramic support herein is advantaged by reasonable design and easy use.

Description

Technical field [0001] The invention relates to the technical field of ceramic support equipment, in particular to an aluminum nitride ceramic support. Background technique [0002] LED bracket is a kind of base electronic component and one of the important components of LED packaging. It mainly provides mechanical bearing, support, air-tight protection for LED chips and interconnection lines, and promotes the heat dissipation of LED devices. In recent years, with semiconductor materials With the improvement of packaging technology and the improvement of luminous flux and light extraction efficiency, power-type LED lights have been widely used in urban landscapes, traffic signs, automotive lighting, billboards, and tunnels. For these LED lamps, the LED bracket is required to have high electrical insulation, high stability, high thermal conductivity, thermal expansion coefficient matching the chip, flatness and high strength. Most of the existing LED lights are packaged with meta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64
CPCH01L33/48H01L33/62H01L33/64H01L33/641
Inventor 刘江华刘冠华范秀丽
Owner SHENGNUO OPTOELECTRONICS TECH QH CO LTD
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