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Organic silicon composition and application thereof

A composition and silicone technology, applied in the directions of adhesive additives, non-polymer adhesive additives, electrical components, etc., can solve the performance degradation, low shrinkage rate, inability to achieve the refractive index, weather resistance, permeability of silicone materials, etc. problems such as comprehensive improvement of light rate and mechanical properties, to achieve the effect of simple application methods

Active Publication Date: 2015-03-25
FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Currently commonly used power LED packaging materials are mainly silicone materials, which have the advantages of low shrinkage and no release of by-products during the curing process. However, there are still many deficiencies in performance such as refractive index and curing hardness.
For this reason, the industry has put forward a variety of solutions in order to improve the corresponding performance of silicone packaging materials. However, although the performance of the modified material in some aspects is indeed improved, it will also lead to some performance in other aspects. decline
[0004] For example, the modification technologies involved in the publication numbers US7527871A, US2004116640A1, EP1424363B1, CN101066446A, CN102181159A, CN103022320A, CN101565535A, etc., cannot realize the synthesis of organic silicon materials in terms of refractive index, weather resistance, light transmittance, mechanical properties, etc. promote

Method used

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  • Organic silicon composition and application thereof
  • Organic silicon composition and application thereof
  • Organic silicon composition and application thereof

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Embodiment Construction

[0030] One aspect of the present invention provides a silicone composition, the base components of which include at least one vinyl siloxane polymer capable of curing by hydrosilylation reaction and at least A Si-H siloxane polymer, and at least one vinyl POSS and vinyl-or phenyl-modified nano-sized silica ).

[0031] Further, the composition may also contain a hydrosilylation curing catalyst, through which the thermal curing of the composition can be realized.

[0032] Furthermore, a hydrosilylation reaction inhibitor can also be added, and then by adjusting the type and amount of the hydrosilylation addition curing catalyst and the hydrosilylation reaction inhibitor, the curing degree and curing rate of the composition can be regulated. wait.

[0033] The aforementioned hydrosilylation addition reaction refers to the reaction of adding silicon hydrides to unsaturated organic compounds to generate various organosilicon compounds. It can be used in three ways: (1) with alken...

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Abstract

The invention discloses an organic silicon composition and application thereof. The organic silicon composition comprises at least one vinyl siloxane polymer capable of curing by silicon hydrogenation addition reaction, at least one hydrogen-radical siloxane polymer, at least one vinyl POSS (polyhedral oligomeric silsesquioxane), organic-group-modified nano silicon dioxide, a silicon hydrogenation addition curing catalyst and other basic components, and can further comprise a silicon hydrogenation addition reaction inhibitor, a binding accelerator and the like. The organic silicon composition has favorable physical and chemical comprehensive properties (including favorable flowability, high curing speed, high curing ratio, high curing hardness, high light transmittance and the like), has the characteristics of high vulcanization resistance, low aging speed, stable performance and the like, is suitable to be used as binding and packaging materials for optical and electronic devices, and is especially suitable to be used as a packaging material for LEDs (light-emitting diodes) and other semiconductor light-emitting elements.

Description

technical field [0001] The present invention particularly relates to a silicone composition, which is suitable for applications such as adhesive compositions and packaging materials. Background technique [0002] LED packaging materials have an important impact on the luminous efficiency, brightness, power and service life of LEDs. Among them, packaging materials with high refractive index, high light transmittance and excellent UV / heat aging resistance can effectively improve the light output rate and service life of LEDs. [0003] Currently commonly used power LED packaging materials are mainly silicone materials, which have the advantages of low shrinkage and no release of by-products during the curing process. However, there are still many deficiencies in performance such as refractive index and curing hardness. For this reason, the industry has put forward a variety of solutions in order to improve the corresponding performance of silicone packaging materials. However,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06H01L23/29H01L33/56
Inventor 张汝志张景博宁新国
Owner FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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