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Biaxially oriented polypropylene protecting film for base material of flexible printed circuit board and preparation method of biaxially oriented polypropylene protecting film

A flexible circuit board, two-way stretching technology, applied in electronic equipment, chemical instruments and methods, applications, etc., can solve the problems of non-soft film, non-peeling, poor heat resistance of polyethylene protective film, etc., to improve market competitiveness , Excellent tear resistance, good printing effect

Active Publication Date: 2015-01-07
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The two ends of the polyethylene protective film are easy to lift after a period of use. The main reason for this phenomenon is that the heat resistance of the polyethylene protective film is poor. During the pasting process with the protected profile, its stretching degree Larger, after adhesion, there will be unnecessary shrinkage in high temperature environment;
[0006] 2. It is difficult to peel off the polyethylene protective film. When peeling off, the protective film cannot be effectively peeled off. This is a very headache for users. The reason is that the material used in the polyethylene protective film master tape is too soft and has low strength. Unable to withstand the pulling force during peeling, breakage occurs during peeling, resulting in tearing or partial non-peeling
[0007] In addition to polyethylene film, a small amount of biaxially oriented polyester film or ordinary biaxially oriented polypropylene film is also used in the field of protective films, but due to the stiffness of biaxially oriented polyester film and ordinary biaxially oriented polypropylene film High density, the film is not soft, and the compliance with the protected substrate is not good, and after adhering to the surface of the substrate, it has a certain impact on the winding of the substrate, and the substrate is not smooth after winding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] a. Mix 3% ethylene-propylene copolymer, 3% ethylene-butylene copolymer, 5% propylene-butene copolymer, 25% low-density polyethylene, and linear low-density polyethylene as the balance to obtain a soft masterbatch;

[0038] Mix 15% of silicon dioxide and the rest as carrier homopolypropylene to obtain an anti-blocking masterbatch.

[0039] b. Mix 1% antistatic masterbatch glycerol monostearate, 30% soft masterbatch, and homopolypropylene as the balance of the middle layer raw materials, dry them, and send them to the main extruder to heat them into a molten state; 3% anti-blocking masterbatch of surface layer raw material, 5% soft masterbatch, and homopolypropylene as the balance are mixed and heated and melted in an auxiliary extruder; 3% anti-blocking masterbatch of inner surface layer raw material, soft masterbatch 10%, antistatic masterbatch 3% glyceryl monostearate, and homopolypropylene as the balance are mixed and heated and melted in another auxiliary extruder; t...

Embodiment 2

[0046] a. Mix 15% ethylene-propylene copolymer, 15% ethylene-butylene copolymer, 3% propylene-butene copolymer, 10% low-density polyethylene, and linear low-density polyethylene as the balance to obtain a soft masterbatch;

[0047] The anti-blocking masterbatch is obtained by mixing 20% ​​of carbon dioxide and the balance of carrier homopolypropylene.

[0048] b. Mix the antistatic masterbatch N, N-dihydroxyethyl octadecylamine 3%, soft masterbatch 10%, and homopolypropylene as the balance, dry and send it to the main extruder for heating into a molten state; mix 5% of the anti-adhesion masterbatch of the outer layer raw material, 5% of the soft masterbatch, and homopolypropylene as the balance, and then heat and melt in an auxiliary extruder; the inner surface layer of the anti-adhesion masterbatch 5%, soft masterbatch 5%, antistatic masterbatch N, N-dihydroxyethyl octadecylamine 1%, homopolypropylene as the balance, then heat and melt in another auxiliary extruder; After th...

Embodiment 3

[0055] a. Mix 10% ethylene-propylene copolymer, 10% ethylene-butylene copolymer, 10% propylene-butylene copolymer, 15% low-density polyethylene, and linear low-density polyethylene as the balance to obtain a soft masterbatch;

[0056] Mix 30% of silicon dioxide and the rest as carrier homopolypropylene to obtain an anti-blocking masterbatch.

[0057] b. Mix 2% antistatic masterbatch fatty alcohol polyether amide, 20% soft masterbatch, and homopolypropylene as the balance of the middle layer raw materials, dry them and send them to the main extruder to heat them into a molten state; 4% anti-blocking masterbatch of surface layer raw material, 8% soft masterbatch, and homopolypropylene as the balance are mixed and heated and melted in an auxiliary extruder; 4% anti-blocking masterbatch of inner surface layer raw material, soft masterbatch 7%, antistatic masterbatch fatty alcohol polyetheramide 2%, and homopolypropylene as the balance, then heat and melt in another auxiliary extru...

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Abstract

The invention discloses a biaxially oriented polypropylene protecting film for a base material of a flexible printed circuit board and a preparation method of the biaxially oriented polypropylene protecting film. The biaxially oriented polypropylene protecting film is of a three-layer structure consisting of an inner surface layer, a middle layer and an outer surface layer, wherein the middle layer comprises an antistatic master batch, a flexible master batch and homo-polypropylene; the inner surface layer comprises an anti-sticking master batch, a flexible master batch, an antistatic master batch and homo-polypropylene; the outer surface layer comprises an anti-sticking master batch, a flexible master batch and homo-polypropylene; the flexible master batch comprises an ethylene-propylene polymer, an ethylene-butylene polymer, a propylene-butylene polymer, low-density polyethylene and linear low-density polyethylene. The biaxially oriented polypropylene protecting film has the advantages of good flexibility, excellent physical performance, optical performance and printing performance, good tear resistance, low static electricity, simple processing process and the like, and the base material can be maximally protected.

Description

technical field [0001] The invention relates to a film, in particular to a biaxially stretched polypropylene protective film for a flexible circuit board base material and a preparation method thereof. Background technique [0002] Flexible circuit boards are mostly made of polyimide film as the base material and are made through a series of complex processes. It is a highly reliable and excellent flexible printed circuit board. It has high wiring density, light weight, and thickness. Thin features. [0003] As a special engineering material, polyimide is one of the organic polymer materials with the best comprehensive performance. Using polyimide substrates to make flexible circuit boards requires the surface of polyimide substrates to be smooth, clean and free of impurities. , which requires the use of a protective film to protect the polyimide substrate after production. [0004] The protective film currently used for polyimide substrates is mainly polyethylene film, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/30B32B27/32B32B27/20B32B38/00C08L23/12C08L23/16C08L23/08C08L23/14C08L23/06C08J3/22B29C47/00B29C55/14
CPCB29D7/01B32B27/08B32B27/20B32B27/32B32B2250/03B32B2250/242B32B2264/02B32B2264/0257B32B2264/0264B32B2264/102B32B2266/0221B32B2307/21B32B2307/5825B32B2323/10B32B2377/00B32B2457/08C08K2201/003C08K2201/017C08L23/12C08L2201/08C08L2203/16C08L2203/20C08L2205/025C08L2205/035C08L2207/066C08L23/06C08L23/0815C08L23/14C08K5/103C08K5/17C08K3/36
Inventor 陈铸红王红兵孙善卫朱峰
Owner ANHUI GUOFENG PLASTIC
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