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Thermosetting Composition, Curing Film, And Electronic Part Possessing Curing Film

A composition and thermosetting technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of insufficient heat resistance and flatness, difficulty in ensuring flatness, and insufficient high flatness, etc., to improve display quality and reliability , high practicability, and excellent flatness

Active Publication Date: 2014-10-15
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The composition of Japanese Patent Laid-Open No. 2005-105264 has good chemical resistance and transparency, but has disadvantages of insufficient heat resistance and flatness
In addition, although the composition of Japanese Patent Application Laid-Open No. 2008-156546 is a material with excellent heat resistance and good flatness, it is insufficient in terms of high flatness required for liquid crystal display elements that have been refined and thinned in recent years.
Furthermore, thinning of the protective film material has also been carried out, but it is difficult to ensure flatness

Method used

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  • Thermosetting Composition, Curing Film, And Electronic Part Possessing Curing Film
  • Thermosetting Composition, Curing Film, And Electronic Part Possessing Curing Film
  • Thermosetting Composition, Curing Film, And Electronic Part Possessing Curing Film

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Embodiment

[0133] Hereinafter, the present invention will be specifically described through synthesis examples, examples, and comparative examples, but the present invention is not limited by these examples.

[0134] First, the polyester amic-acid solution (synthesis example 1 and 2) containing the reaction product of tetracarboxylic dianhydride, diamine, and a polyhydric hydroxyl compound was synthesize|combined as follows.

Synthetic example 1

[0135] [Synthesis Example 1] Synthesis of Polyester Amic Acid Solution (A1)

[0136] In a four-necked flask with a stirrer, add dehydrated and purified methyl 3-methoxypropionate (hereinafter referred to as "MMP"), 3,3',4,4'-diphenyl ether Tetracarboxylic dianhydride (hereinafter referred to as "ODPA"), 1,4-butanediol, and benzyl alcohol were stirred at 130° C. for 3 hours under a dry nitrogen stream.

[0137]

[0138] Then the reaction solution was cooled to 25°C, and 3,3'-diaminodiphenylsulfone (abbreviated as "DDS") and MMP were put into the following weights, stirred at 20-30°C for 2 hours, and then stirred at 115°C for 1 hour. Hour.

[0139] DDS 29.33g

[0140] MMP 183.04g

[0141] [Z / Y=3.0, (Y+Z) / X=0.8]

[0142] The solution was cooled to room temperature to obtain a pale yellow transparent 30% by weight polyester amic acid solution (A1).

[0143] A portion of the solution was sampled and the weight average molecular weight was determined by GPC analysis (polysty...

Synthetic example 2

[0144] [Synthesis Example 2] Synthesis of Polyester Amic Acid Solution (A2)

[0145] In a four-necked flask with a stirrer, dehydrated and purified propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA"), 1,2,3,4-butanetetracarboxylic dianhydride (hereinafter referred to as "BT-100"), SMA1000P (trade name; styrene-maleic anhydride copolymer, Chuanyuan Petrochemical Co., Ltd.), 1,4-butanediol, benzyl alcohol, stirred at 125°C for 3 Hour.

[0146]

[0147] Then, the reaction liquid was cooled to 25° C., DDS and PGMEA were charged in the following weights, and stirred at 20 to 30° C. for 2 hours, and then at 125° C. for 2 hours.

[0148] DDS 10.50g

[0149] PGMEA 57.69g

[0150] [Z / Y=2.7, (Y+Z) / X=0.9]

[0151] The solution was cooled to room temperature to obtain a pale yellow transparent 30% by weight polyester amic acid solution (A2).

[0152] A portion of the solution was sampled and the weight average molecular weight was determined by GPC analy...

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Abstract

The present invention relates to a thermosetting composition which contains polyester amide acid, an epoxy compound and an imidazole compound at particular quantities, a curing film obtained by the thermosetting composition, and an electronic part possessing the curing film. The polyester amide acid is obtained by the reaction of the compounds comprising the tetracarboxylic dianhydride, the diamidogen and the multiple hydroxyl compounds, the epoxy compound contains 2-20 epoxy groups in each molecule, and the weight-average molecular weight is less than 5000. By the composition of the present invention, the curing film of excellent flatness and excellent transparency and heat resistance can be formed.

Description

technical field [0001] The present invention relates to an insulating material that can be used to form an insulating material in electronic parts, a passivation film in a semiconductor device, a buffer coating film, an interlayer insulating film, a planarizing film, an interlayer insulating film in a liquid crystal display element, and a color filter. A thermosetting composition such as a protective film for a color filter, a transparent film obtained from the thermosetting composition, and an electronic component having the film. Background technique [0002] In the manufacturing process of elements such as liquid crystal display elements, various chemical treatments such as organic solvents, acids, and alkali solutions are sometimes performed, or when wiring electrodes are formed into films by sputtering, the surface is partially deposited on the surface. Heat over high heat. Therefore, surface protection films are sometimes provided in order to prevent deterioration, da...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08L63/00C08L79/08G02B5/20G02F1/1335G02F1/1333
Inventor 近藤学
Owner JNC CORP
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