Method for preparing Ba1-xSrxTiO3/Bi1.5MgNb1.5O7 (BST/BMN) composite film voltage-controlled varactor tube
A composite film, varactor technology, applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problem of low dielectric tuning rate, high dielectric loss of BST film material, limited BST film application, etc. problems, to achieve the effect of good device stability, moderate tuning rate, and low dielectric loss
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Embodiment 1
[0026] (1) Prepare BMN target and BST target by solid phase sintering method:
[0027] Press Bi with electronic balance 1.5 MgNb 1.5 o 7 The stoichiometric ratio of the corresponding elements is called Bi 2 o 3 , MgO and Nb 2 o 5 (purity is 99%), after fully mixing, press molding under the pressure of 20Mpa, put in box-type electric furnace and gradually heat up to 1150 ℃, and keep warm for 5 hours;
[0028] Press Ba with electronic balance 0.6 Sr 0.4 TiO 3 The stoichiometric ratio of the corresponding elements weighs BaCO 3 , SrCO 3 and TiO 2 , (purity is 99%) after being fully mixed, pressed under the pressure of 30Mpa, and finally placed in a box-type electric furnace and gradually heated to 1450 ° C, and kept for 10 hours.
[0029] (2) Clean the Pt-Si substrate with N 2 Blow dry and place on magnetron sputtering sample stage.
[0030] (3) Pump the background vacuum of the magnetron sputtering system to 8.0×10 -6 Torr, and then heat the substrate to 400°C.
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Embodiment 2
[0037] (1) Prepare BMN target and BST target by solid phase sintering method:
[0038] Press Bi with electronic balance 1.5 MgNb 1.5 o 7 The stoichiometric ratio of the corresponding elements is called Bi 2 o 3 , MgO and Nb 2 o 5 (purity is 99%), after fully mixing, press molding under the pressure of 20Mpa, put in box-type electric furnace and gradually heat up to 1150 ℃, and keep warm for 5 hours;
[0039] Press Ba with electronic balance 0.6 Sr 0.4 TiO 3 The stoichiometric ratio of the corresponding elements weighs BaCO 3 , SrCO 3 and TiO 2 , (purity is 99%) after being fully mixed, pressed under the pressure of 30Mpa, and finally placed in a box-type electric furnace and gradually heated to 1450 ° C, and kept for 10 hours.
[0040] (2) Clean the Pt-Si substrate with N 2 Blow dry and place on magnetron sputtering sample stage.
[0041] (3) Pump the background vacuum of the magnetron sputtering system to 8.0×10 -6 Torr, and then heat the substrate to 400°C.
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