Halogen-free resin composition, prepreg prepared from halogen-free resin composition and laminated board prepared from halogen-free resin composition and used for printed circuit

Abstract

The invention discloses a halogen-free resin composition, a prepreg prepared from the halogen-free resin composition and a laminated board prepared from the halogen-free resin composition and used for a printed circuit. The halogen-free resin composition comprises alkylphenol epoxy resin, benzoxazine resin, an alkylphenol aldehyde curing agent and a phosphorus-contained flame retardant. The molecular structure of alkylphenol epoxy resin adopted in the halogen-free resin composition contains more branched alkyls, so that the halogen-free resin composition is relatively high in glass transition temperature, low in water absorption rate, favorable in heat resistance and excellent in dielectric performance; benzoxazine resin is mixed, so that the dielectric constant, dielectric loss value and water absorption rate of a solid can be further reduced; alkylphenol aldehyde is used as a curing agent, so that the advantages of excellent dielectric performance and low water absorption rate generated by more alkyls in the structure are sufficiently exerted. The prepreg prepared from the halogen-free resin composition and the laminated board prepared from the halogen-free resin composition and used for the printed circuit have the advantages of low dielectric constant, low dielectric loss factor, low water absorption rate, high size stability, high heat resistance, and favorable flame retardance, processability and chemical resistance.

Description

technical field [0001] The present invention relates to a halogen-free resin composition and a prepreg and a laminate using the same, which have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high heat resistance and good Flame retardancy, processing performance and chemical resistance and other advantages. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection ...

AI Technical Summary

Problems solved by technology

The bonding sheet and copper-clad laminate for printed circuit boards prepared by the epoxy resin composition not only have green and environmentally friendly flame retardancy, but also have excellent dielectric properties, but the water absorption rate of the bonding sheet and copper-clad laminate is as high as 0.3 %~0.4%, it is easy to absorb moisture and explode in the subsequent PCB manufacturing process, and the dielectric properties are average, so it is difficult to meet the high-frequency development of electronic signal transmission and high-speed information processing in the printed circuit CCL industry

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