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Manufacturing method of single-layer brazing diamond grinding wheel

A single-layer diamond and diamond grinding wheel technology, used in the manufacture of tools, metal processing equipment, abrasives, etc., can solve the problems of reduced plasticity and toughness of welded joints, and achieve the effects of enhanced wear resistance, better mixing and lower raw material costs.

Inactive Publication Date: 2014-05-28
ZHONGYUAN ENGINEERING COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to aim at the problem that the activity of Ti is high, and the plasticity and toughness of welded joints are reduced due to easy oxidation, and the TiH 2 Substitute Ti for Cu-Sn-TiH 2 Method for making brazed diamond tools

Method used

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  • Manufacturing method of single-layer brazing diamond grinding wheel

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Effect test

Embodiment 1

[0018] A method for making brazed single-layer diamond grinding wheel: using TiH 2 As an active Ti source, Cu-Sn-TiH is used 2 The manufacture method of the brazing diamond tool selects Q235 steel as the grinding wheel matrix, and utilizes the method of mechanical processing to prepare the matrix of the diamond tool, degreases and derusts the processed grinding wheel matrix, selects 50 parts of Cu powder, 25 parts of Sn powder, 15 parts part TiH 2 Powder and 10 parts of WC powder are used as brazing material, among which Cu powder, Sn powder and TiH 2 The particle size of the powder is 80~200μm, and the particle size of the WC powder is 5~50μm; the solder is mechanically stirred for 25 minutes to mix evenly, and then the tool blank is prepared in the order of tool matrix / brazing material / diamond abrasive grains; diamond abrasive grains are placed on the surface 25 grains / cm 2 , the diamond particle size is 200~240μm, the abrasive particles are evenly distributed, the brazin...

Embodiment 2

[0020] A method for making brazed single-layer diamond grinding wheel: using TiH 2 As an active Ti source, Cu-Sn-TiH is used 2 The manufacture method of the brazing diamond tool selects Q235 steel as the grinding wheel substrate, and utilizes the method of mechanical processing to prepare the substrate of the diamond tool, degreases and derusts the processed grinding wheel substrate, selects 55 parts of Cu powder, 20 parts of Sn powder, 10 part TiH 2 Powder and 15 parts of WC powder are used as brazing material, among which Cu powder, Sn powder and TiH 2 The particle size of powder is 80~200μm, and the particle size of WC powder is 5~50μm; mechanically stir the solder for 30 minutes to mix evenly, and then prepare tool blanks in the order of tool matrix / brazing filler metal / diamond abrasive grains; place diamond abrasive grains on its surface 25 grains / cm 2 , the diamond particle size is 200~240μm, the abrasive particles are evenly distributed, the brazing material is place...

Embodiment 3

[0022] A method for making brazed single-layer diamond grinding wheel: using TiH 2 As an active Ti source, Cu-Sn-TiH is used 2 The manufacture method of the brazing diamond tool selects Q235 steel as the grinding wheel matrix, and utilizes the method of mechanical processing to prepare the matrix of the diamond tool, degreases and derusts the processed grinding wheel matrix, selects 50 parts of Cu powder, 30 parts of Sn powder, 15 parts part TiH 2 powder and 5 parts of WC powder as solder, including Cu powder, Sn powder and TiH 2 The particle size of the powder is 80~200μm, and the particle size of the WC powder is 5~50μm; the brazing filler metal is mechanically stirred for 20 minutes to mix evenly, and then the tool blank is prepared in the order of tool matrix / brazing filler metal / diamond abrasive grain; diamond abrasive grains are placed on the surface 25 grains / cm 2 , the diamond particle size is 200~240μm, the abrasive particles are evenly distributed, the brazing mat...

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Abstract

The invention discloses a manufacturing method of a single-layer brazing diamond grinding wheel. The manufacturing method includes steps of preparing a base body of the diamond grinding wheel by a machining method, deoiling and descaling; utilizing mixture of Cu powder, Sn powder, TiH2 powder and WC (wolfram carbide) powder as brazing filler metal of the diamond grinding wheel, and mechanically blending uniformly; sequentially arranging the base body, the brazing filler metal and diamond grains of the diamond grinding wheel to manufacture a tool forming blank; placing the tool forming blank into a vacuum furnace, subjecting the brazing filler metal and the diamond grains to chemical reaction by means of brazing process, cooling to the room temperature along with the furnace, and discharging. Cost for raw materials can be reduced to some extent and oxidation pollution can be avoided by utilizing TiH2 as a Ti source, wear resistance and heat resistance of the brazing filler metal can be improved by adding the superfine WC powder into the Cu powder, the Sn powder and the TiH2 powder, graphitization of diamond can be reduced, thereby heat damage of the diamond can be reduced, and the diamond grinding tool can sufficiently give into play.

Description

technical field [0001] The invention belongs to the field of making superhard abrasive tools, in particular to a method for making a brazed single-layer diamond grinding wheel. Background technique [0002] The brazed single-layer diamond grinding wheel realizes a strong chemical metallurgical bond on the interface between diamond, bonding agent (brazing filler metal) and metal matrix, so that the diamond exposure height reaches 2 / 3 of the particle size, and it does not fall off during work. Therefore, the brazed grinding wheel is sharp, has a large chip space, is not easy to be blocked, and can fully utilize the abrasive. Under the same conditions as the electroplated grinding wheel, the grinding force, power consumption and grinding temperature are lower. [0003] The brazing filler metals for brazing diamond mainly include Ag-Cu-Ti alloy-based silver-based filler metals and Ni-Cr alloy-based nickel-based filler metals. The melting point of Ag-Cu-Ti solder is low, but th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B24D3/00
Inventor 卢金斌赵彬张旺玺刘磊贺亚勋樊平
Owner ZHONGYUAN ENGINEERING COLLEGE
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