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Preparation method of low-linear expansion coefficient polyimide film

A technology of polyimide film and low coefficient of linear expansion, which is applied in the field of preparation of polyimide film with low coefficient of linear expansion, can solve problems such as the complexity of the preparation process, achieve simple and easy control of the preparation process, improve barrier properties, and generate high efficiency effect

Inactive Publication Date: 2014-05-07
太湖华强科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The linear expansion coefficient of polyimide film is slightly higher than that of copper, although it is close to copper, but the preparation process is more complicated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0022] A kind of preparation method of polyimide film with low coefficient of linear expansion, comprises the following steps:

[0023] 1) Using 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether in dimethylacetamide solvent , react at room temperature for 3 to 4 hours to prepare a polyamic acid solution, the molar ratio of the total anhydride to diamine is 1:1, wherein pyromellitic dianhydride and 3,3',4,4'-linked The molar ratio of pyromellitic dianhydride is 70-80:30-20, the molar ratio of 4,4'-diaminodiphenyl ether to p-phenylenediamine is 70-80:30-20,

[0024] 2) Cast the polyamic acid solution prepared in the step 1) by casting method, and stretch it vertically and horizontally at the same time. At the entrance of the stretching machine, clamp it with clamps, and the clamps on both sides are in the same direction , Synchronous operation, the operating speed is 150 ~ 200g / min, fully preheated in t...

Embodiment 1

[0027] 1) Using 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether in dimethylacetamide solvent , react at room temperature for 3 to 4 hours to prepare a polyamic acid solution, the molar ratio of the total anhydride to diamine is 1:1, wherein pyromellitic dianhydride and 3,3',4,4'-linked The molar ratio of pyromellitic dianhydride is 70:30, the molar ratio of 4,4'-diaminodiphenyl ether to p-phenylenediamine is 70:30,

[0028] 2) Cast the polyamic acid solution prepared in the step 1) by casting method, and stretch it vertically and horizontally at the same time. At the entrance of the stretching machine, clamp it with clamps, and the clamps on both sides are in the same direction , Synchronous operation, the operating speed is 200g / min, fully preheated in the preheater, in the stretching machine, with the help of clamps to expand the width and gradually increase the distance between the clamps, to real...

Embodiment 2

[0030] 1) Using 3,3',4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, p-phenylenediamine and 4,4'-diaminodiphenyl ether in dimethylacetamide solvent , react at room temperature for 3 to 4 hours to prepare a polyamic acid solution, the molar ratio of the total anhydride to diamine is 1:1, wherein pyromellitic dianhydride and 3,3',4,4'-linked The molar ratio of pyromellitic dianhydride is 75:25, the molar ratio of 4,4'-diaminodiphenyl ether to p-phenylenediamine is 75:25,

[0031] 2) Cast the polyamic acid solution prepared in the step 1) by casting method, and stretch it vertically and horizontally at the same time. At the entrance of the stretching machine, clamp it with clamps, and the clamps on both sides are in the same direction , Synchronous operation, the operating speed is 150 ~ 160g / min, fully preheated in the preheater, in the stretching machine, with the aid of clamps to expand the width and gradually increase the distance between the clamps, to...

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Abstract

The invention discloses a preparation method of a low-linear expansion coefficient polyimide film. The preparation method comprises the following steps: enabling 3,3',4,4'-Biphenyl tetracarboxylic diandhydride, pyromellitic dianhydride, p-phenylenediamine, 4,4'-diaminodiphenyl ether to react in a dimethylacetamide solvent so as to prepare a polyamide acid solution, carrying out tape casting by using a tape-casting method, clamping by using clamps at an inlet of a stretcher, wherein the clamps at the two sides synchronously move in the same direction, and the operating speed is 150-200g / min, realizing the longitudinal and transverse stretching orientation of the film through the movement of expanding with the help of the clamps and regularly and gradually increasing the interval between the clamps, finally carrying out heating treatment, cooling and rolling. The preparation method has the beneficial effects that the linear expansion coefficient of the obtained low-linear expansion coefficient polyimide film is only 14-16 (ppm / DEG C), which is obtained by complete imidization caused by high stretch rate and two-times high-temperature thermal treatment, the possibility of short-circuiting of circuit boards is greatly reduced, and the service life of the circuit boards is prolonged.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing a polyimide film with a low coefficient of linear expansion. Background technique [0002] Polyimide film includes two types: isophenylene polyimide film and biphenyl polyimide film. Due to its superior comprehensive performance, it can be processed into films, coatings, plastics, composite materials, adhesives, foam plastics, fibers, separation membranes, liquid crystal alignment agents, photoresists, etc. It is widely used in aviation, aerospace, microelectronics and gas separation. use. [0003] In recent years, with the light weight, miniaturization and high density of electronic products, the demand for various printed substrates is increasing. A graphical representation of the wiring, which is capable of connecting or supporting various components. Such printed circuit boards can be divided into rigid printed circuit boards, flexible pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18B29C69/02B29C55/16B29C41/24
CPCC08L79/08B29C41/24B29C55/16B29C69/02C08G73/1007C08J5/18C08J2379/08C08L2203/16C08L2203/20
Inventor 丁云保
Owner 太湖华强科技有限公司
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