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Method for improving leakage current characteristics of dry-type multilayer ceramic capacitors

A technology of laminated ceramics and leakage current, which is applied in the direction of fixed capacitor electrodes and parts of fixed capacitors, etc., can solve the problems that the leakage current characteristics are difficult to improve, and achieve the advantages of improving leakage current characteristics, improving evaporation conditions, and strong stability Effect

Inactive Publication Date: 2016-09-28
大连天壹电子有限公司
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  • Application Information

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Problems solved by technology

[0005] The present invention aims to solve the problem that the leakage current characteristics of dry-type laminated ceramic capacitors in the prior art are difficult to improve

Method used

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  • Method for improving leakage current characteristics of dry-type multilayer ceramic capacitors
  • Method for improving leakage current characteristics of dry-type multilayer ceramic capacitors
  • Method for improving leakage current characteristics of dry-type multilayer ceramic capacitors

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Embodiment Construction

[0035] Such as Figure 1-3 As shown, the method for improving the leakage current characteristics of dry-type laminated ceramic capacitors includes the following steps:

[0036] S1: Wafer preparation stage;

[0037] S2: specify the electrode layer on the wafer and the stacked layer number stage of the dielectric layer;

[0038] S3: the stage of forming an initial insulating layer on the wafer;

[0039] S4: a stage of forming an electrode layer on the initial insulating layer;

[0040] S5: a stage of forming a dielectric layer on the electrode layer;

[0041] S6: The stage in which electrode layers and dielectric layers are repeatedly laminated;

[0042] S7: After lamination, the stage of heat treatment of electrode layer and dielectric layer;

[0043] S8: the stage of forming a protective layer after heat treatment;

[0044] S9: After the protective layer is formed, the wafer back grinding stage;

[0045] S10: Cutting stage in chip form after wafer back grinding;

[00...

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Abstract

Provided is a leakage current characteristic improvement method of a dry type lamination ceramic capacitor. The method comprises the following phases: preparing a wafer; specifying an electrode layer on the wafer and the lamination layer number of a dielectric layer; forming an initial insulating layer on the wafer; forming the electrode layer on the initial insulating layer; forming the dielectric layer on the electrode layer; repeatedly performing lamination on the electrode layer and the dielectric layer; after the lamination, performing heat treatment on the electrode layer and the dielectric layer; forming a protective layer after the heat treatment; grinding the back surface of the wafer after the protective layer is formed; performing cutting in the form of a chip after the back surface of the wafer is grinded; and forming an external electrode by the cut chip. According to the invention, a diffusion prevention membrane is formed during the phase of forming an internal electrode so that in case of change in external environment, internal electrode substances are prevented from being diffused into the dielectric layer. Besides, the dielectric layer is not crystallized, and proper heat treatment is carried out after an internal electrode layer and the dielectric layer are laminated, so that the method for manufacturing a high-quality capacitor with a higher leakage current characteristic is provided.

Description

technical field [0001] The invention relates to a method for improving dry-type laminated ceramic capacitors, in particular to a method for improving leakage current characteristics of dry-type laminated ceramic capacitors. Background technique [0002] MLCC—that is, multi-layer ceramic capacitors (Multi-layer ceramic capacitors) are capacitors manufactured as multi-layer electroplated metal films, and are accessories for temporary storage. It is mainly used in TV, VCR, PC, automotive electronics, mobile communication, digital AV machine, computer and other electrical appliances, and plays the role of DC-blocking, By-passing and AC. [0003] MLCCs are manufactured by stacking internal electrode layers and dielectric layers so that multiple capacitors are connected in parallel. There are two methods for forming the electrode layer and the dielectric layer. First, a liquid raw material is used as a raw material, and a wet method using a dielectric sheet of a ceramic material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/005
Inventor 高在洪
Owner 大连天壹电子有限公司
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