Antistatic BOPP film and composite construction process preparation technology

Abstract

The invention provides an antistatic BOPP film and a composite construction process preparation technology. According to the upper surface of the BOPP film, a blended type resin matrix formed by self-polarized polypropylene and conventional polypropylene is employed, and further cooperated with an antistatic agent for constituting a polypropylene composite matrix and further forming a sub-microscopic blended composite system, so that the antistatic function of the film is improved; and core layer and the heat-sealed lower surface layer are prepared by employing a common polypropylene material, so that the various original functions of the film are kept, and the core layer, the heat-sealed lower surface layer and the upper surface layer give play to synergistic effect, so that the BOPP film has the enhanced function, and the cost is saved. The antistatic upper surface layer with special construction, the common core layer and the heat-sealed lower surface layer together constitute a topological composite structural system with multiple layers, multiple dimensions and multiple phases. The BOPP film prepared by employing the composite construction process not only possesses various performances, such as mechanical properties and the like, same to those of conventional BOPP films, but also possesses excellent antistatic function, and can reach the antistatic requirements of packages of fittings such as electronic circuit boards and the like, electronic components, and the like.

Description

technical field [0001] The invention belongs to the field of plastic films, and in particular relates to a compound structure antistatic BOPP film and a preparation process thereof. Background technique [0002] Polymer synthetic materials are currently widely used as packaging materials. However, the high insulation of polymer materials such as plastics makes it prone to electrostatic hazards. Static electricity is ubiquitous in daily life, and its harm to electronic goods in circulation has been fully recognized and valued by people more and more. The generation of static electricity in the process of packaging, storage and transportation is inevitable, and the miniaturization of electronic products and the high density of integrated circuits make them more and more sensitive. For example, if the packaging material of the electronic circuit board has no anti-static function, the static electricity generated by friction is not easy to dissipate. After accumulating to a ce...

AI Technical Summary

Problems solved by technology

Although the antistatic packaging film has a certain effect of eliminating static electricity, it cannot completely eliminate static electricity. Therefore, the antistatic film cannot be used as a packaging film for products with high antistatic requirements such as electronic components such as electronic circuit boards and electronic components.

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