Silver conductive ink and method for manufacturing printed circuit with same

Abstract

The invention belongs to silver conductive ink and a method for manufacturing a printed circuit with the ink. The silver conductive ink comprises reducing agents, saturated [Ag(NH3)2]+ solutions and buffering agent dilute nitric acid. The method for manufacturing the printed circuit with the ink comprises circuit printing, solidification treatment and sintering. Firstly, silver nitrate and water are prepared into silver nitrate aqueous solutions, ammonium hydroxide is added to the silver nitrate aqueous solutions to prepare the saturated [Ag(NH3)2]+ solutions, and then the alkylol amine reducing agents and the buffering agent dilute nitric acid are added. When the printed circuit is manufactured, the solidification treatment is carried out under the condition of low-temperature heating, the silver conductive ink carries out silver mirror reaction-oxidizing reaction-silver mirror reaction repeatedly in the heat solidification process, and the printed circuit is manufactured through the high-temperature sintering. Therefore, the silver conductive ink and the method have the advantages that the silver conductive ink is short in production process procedure and low in cost, in the solidification treatment, reaction temperature is low, a manufactured silver wire is smooth in surface and good in compactness, silver purity is high, adhesive force to a substrate is strong, and the electric conduction and other performance of the circuit are good.

Description

technical field [0001] The invention belongs to the silver conductive ink and its printed circuit method in the technical field of functional materials, in particular to a silver conductive ink which can be widely used for printing conductive circuits (circuits) on flexible substrates and the ink used for printing circuit method. Background technique [0002] In recent years, more and more research is being devoted to all-printed electronics, especially in the application of flexible electronic devices, such as flexible display devices, solar cells, radio frequency identification devices, etc. This kind of fully printed electronic technology is different from the traditional etching method to produce printed circuits. It can be widely used to print conductive lines (circuits) on flexible substrates, and has the ability to print circuits on flexible substrates or semiconductor films. Features of convenience, speed and low cost. [0003] At present, the materials used in all...

AI Technical Summary

Problems solved by technology

Although this method has the advantages of simple preparation of conductive ink and low curing temperature during use; but because the conductive ink will quickly evaporate to dryness in 15-20 minutes under the heating condition of 70-90°C, the reduced silver cannot be obtained sufficiently. The crystal growth and the conditions attached to the substrate; thus there are the following defects: First, the method directly uses silver oxide and ammonia water reaction (ie silver mirror reaction), the stability of the resulting conductive ink is extremely poor, and it is carried out at low temperature during use. Curing can not remove high-temperature impurities to improve the morphology of the wire; second, due to the poor adhesion of silver, in the cleaning process, in addition to removing unreacted substances, there are also a large amount of silver that is not fixed on the substrate. The particles are also washed away together, resulting in poor flatness and poor compactness of the cured wire, and there are many small gaps. These small gaps will generate parasitic capacitance during use and affect the electrical performance of the circuit (device). ; In addition, its scanning electron microscope image shows that the cured conductive circuit is formed by connecting and forming particles of 80-100nm, the contact area between the particles is small, and the strength of the formed circuit is also low

Images