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A low-splash halogen-free solder for tin wire and preparation method thereof

A technology of tin wire and soldering powder, which is applied in the formulation and preparation of soldering powder, can solve the problems of immune system, endocrine system poisoning, affecting the reproduction and development of organisms, corrosiveness, etc., and achieves good wettability and reliability High performance and high surface insulation resistance

Inactive Publication Date: 2017-04-05
BEIJING COMPO ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these halogen-containing substances exist in the form of covalent bonds at low temperatures, they will be decomposed into ions when the temperature is as high as 350°C during welding, so the residues after welding will also be corrosive.
[0005] In addition, most halides are environmental hormone substances, which have toxic effects on the immune system and endocrine system, and have carcinogenic effects on organisms and other toxic reactions (mental and psychological disorders), seriously affecting the reproduction and development of organisms

Method used

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  • A low-splash halogen-free solder for tin wire and preparation method thereof
  • A low-splash halogen-free solder for tin wire and preparation method thereof
  • A low-splash halogen-free solder for tin wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018]

[0019] (1) Add the refined hydrogenated rosin and water-white rosin into the reaction kettle, heat to 140°C until they are completely melted;

[0020] (2) Add succinic acid, adipic acid, FC-4430, benzotriazole and petrolatum in sequence;

[0021] (3) Stir continuously until all components are completely dissolved.

Embodiment 2

[0023]

[0024] (1) Add fully hydrogenated rosin AX-E (Eastman) and maleic acid-modified rosin into the reaction kettle, heat to 140°C until completely melted;

[0025] (2) Add phenylsuccinic acid, alkyl modified dimethyl siloxane, triethanolamine and polyethylene glycol 4000 in sequence;

[0026] (3) Stir continuously until all components are completely dissolved.

Embodiment 3

[0028]

[0029]

[0030] (1) Add rosin KE604 (Arakawa) into the reaction kettle, heat to 140°C until all melted;

[0031] (2) Add phthalic acid, polydimethylsiloxane, 2-ethylimidazole and polyethylene glycol 6000 in sequence;

[0032] (3) Stir continuously until all components are completely dissolved.

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PUM

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Abstract

The invention discloses a low-splash and halogen-free welding agent for tin wires and a preparation method thereof. The welding agent is mainly used for agent cores of tin-based alloy tin wires. The welding agent is composed of, by weight, 80-90% of rosin and rosin derivatives, 5-15% of active agents, 0.1-2% of efficient surface active agents, 0.5-2% of corrosion inhibitors and 3-10% of viscosity modifiers. The prepared halogen-free welding agent for the tin wires is needless of any halogen element, is little in splash and smoke when welding is conducted, has high activity, is high in surface insulation resistance, and can be used for preparing tin-lead series tin wires, tin-copper series tin wires and tin-silver-copper series tin wires. The prepared tin wires are good in wetting performance, high in reliability after being welded, and light and full in welding point.

Description

technical field [0001] The present invention relates to a solder formulation and a preparation method thereof, and mainly relates to a halogen-free solder for tin wire prepared by the present invention, which does not add any halogen elements, has less spatter and less smoke during welding, and has a higher Activity and wettability, plump solder joints after soldering, low-spatter halogen-free solder for tin wire with high surface insulation resistance and its preparation method. Background technique [0002] Tin wire is an important industrial raw material for connecting electronic components in welding lines, and is widely used in electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. [0003] In order to ensure its high activity and solderability, traditional tin wire often adds halogen-containing compounds as active agents, such as the use of hydrobromide and hydrochloride in the patent CN1110204A "a neutral flu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363
Inventor 朱捷卢茂成赵朝辉张焕鹍
Owner BEIJING COMPO ADVANCED TECH
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