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A kind of high-performance halogen-free lead-free solder paste and preparation method thereof

A halogen-free lead-free solder paste, high-performance technology, applied in the field of high-performance halogen-free lead-free solder paste and its preparation, can solve the problems of blackening of the periphery after soldering, a large number of tin beads, and a large number of residues, and achieve solder joints Bright and full, less residue, low corrosion effect

Active Publication Date: 2021-05-11
深圳市可为锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solder paste has high activity, low corrosion, and less residue, which can well solve the common problems of the current low-temperature lead-free solder paste, such as blackening of the periphery after soldering, a large number of tin beads, and a large number of residues, and greatly reduce Reduce the defective rate of printing and improve the reliability of welding

Method used

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  • A kind of high-performance halogen-free lead-free solder paste and preparation method thereof
  • A kind of high-performance halogen-free lead-free solder paste and preparation method thereof
  • A kind of high-performance halogen-free lead-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A high-performance halogen-free lead-free solder paste, including the following components in terms of mass percentage: 80% of Sn58Bi42 alloy powder, 4% of tin lactate, 1% of dioctanoic acid phosphate, 0.5% of hydroxyethylene diphosphonic acid, polyaniline 1%, 0.5% diisooctyl diphenylamine, 2% polyamide-modified hydrogenated castor oil, 3% hydrogenated rosin resin, 8% co-solvent.

[0032] The auxiliary solvent is composed of ethyl borate, N,N-dimethylacetamide, and diethylene glycol butyl ether in a mass ratio of 2:1.5:4.

[0033] Preparation steps:

[0034] S1: Add hydrogenated rosin resin, polyamide-modified hydrogenated castor oil, polyaniline, dicaprylic acid phosphate, ethyl borate, N,N-dimethylacetamide, diethylene glycol butyl ether into the reaction kettle, Fully stir and dissolve at 100°C, add diisooctyl diphenylamine and hydroxyethylene diphosphonic acid when the solution is cooled to 80°C, stir evenly, continue to cool to room temperature, add tin lactate an...

Embodiment 2

[0038] A high-performance halogen-free lead-free solder paste, including the following components in terms of mass percentage: 85% of Sn58Bi0.3Ag41.7 alloy powder, 5% of zinc salicylate, 2% of dicapric acid phosphate, hydroxyethylene di Phosphonic acid 0.2%, polyaniline 0.5%, dialkyl diphenylamine 0.5%, ethylene bis stearic acid amide 1.8%, disproportionated rosin resin 2%, cosolvent 3%.

[0039] The auxiliary solvent is composed of ethyl borate, N,N-dimethylacetamide, and diethylene glycol butyl ether in a mass ratio of 4:3:5.

[0040] Preparation steps:

[0041] S1: Add disproportionated rosin resin, ethylene bis stearic acid amide, polyaniline, dicapric acid phosphate, ethyl borate, N,N-dimethylacetamide, diethylene glycol butyl ether to the reaction kettle , fully stirred and dissolved at 120°C, when the solution was cooled to 70°C, added dialkyl diphenylamine and hydroxyethylene diphosphonic acid, stirred evenly, continued to cool to room temperature, added zinc salicyla...

Embodiment 3

[0045] A high-performance halogen-free lead-free solder paste, including the following components in terms of mass percentage: Sn64.5Bi35Cu0.5 alloy powder 82.5%, zinc citrate 2%, monoisodecanoic acid phosphate 2%, hydroxyethylene di Phosphonic acid 1%, polyaniline 1.5%, butyloctyldiphenylamine 0.5%, hydrogenated castor oil 0.5%, polymerized rosin 4%, cosolvent 6%.

[0046] The auxiliary solvent is composed of ethyl borate, N,N-dimethylacetamide, and diethylene glycol butyl ether in a mass ratio of 3:2:3.

[0047] Refer to Example 1 for the preparation steps.

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Abstract

The invention discloses a high-performance halogen-free lead-free solder paste and a preparation method thereof. The halogen-free lead-free solder paste includes the following components in mass percentage: 80-90% of tin-based alloy powder, 2-5% of metal salt of hydroxy acid, 1-2% of acidic alkyl phosphate, hydroxyethylene 0.2-1% of diphosphonic acid, 0.5-1.5% of polyaniline, 0.1-0.5% of amine antioxidant, 0.5-2% of rheological additive, 2-4% of film forming agent and 3-8% of cosolvent. The solder paste of the present invention has high activity, low corrosiveness, and less residue, which can well solve the common problems of current low-temperature lead-free solder paste such as blackening of the periphery after soldering, a large number of tin beads, and a large number of residues, and can greatly reduce Reduce the defective rate of printing and improve the reliability of welding.

Description

technical field [0001] The invention relates to the technical field of electronic packaging soldering materials, in particular to a high-performance halogen-free lead-free solder paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the demand for heat-sensitive low-temperature soldering applications such as intelligent hardware radiators, LED lighting component placement, and solar photovoltaics has grown rapidly. Lead-free solder paste is widely used as the connection material of electronic components and circuit boards. The solder paste prepared by lead-free alloy solders such as SnAgCu and SnAg currently used generally has a reflow temperature above 230°C, which cannot meet the requirements of low-temperature soldering. Not suitable for soldering processes of heat-sensitive electronic components. Therefore, tin-bismuth-based lead-free solder paste with a lower melting point has become the preferred...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/36B23K35/363B23K35/40
CPCB23K35/26B23K35/262B23K35/36B23K35/3612B23K35/40
Inventor 何雪连
Owner 深圳市可为锡业有限公司
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