Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of underfill and composition, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of production line bottleneck, long curing time, poor fluidity, etc., and achieve fast flow speed, fast curing speed, The effect of increasing toughness and adhesion
Active Publication Date: 2013-10-23
上海禧合应用材料有限公司
View PDF4 Cites 7 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0007] 2. The curing conditions can match the existing production process, and the longer curing time may become the bottleneck of the production line;
[0014] 1. The viscosity is high, generally around 3000cps, the fluidity is very poor at room temperature, and it is easy to generate air bubbles during the flow process, so it needs to be preheated to 50-80°C to improve its fluidity;
[0015] 2. The curing time is long, and it takes 15-30 minutes to cure above 150°C, which is easy to become the bottleneck of the production line;
[0016] 3. From the perspective of energy cost, the consumption of energy is relatively large
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
[0061] Boron trifluoride-piperidine complex: 15.5 kg.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses an underfill adhesive composition and belongs to the field of chemical adhesives. The underfill adhesive composition is prepared from the following raw materials in parts by weight: 50 to 80 parts of hydrogenated epoxy resin, 1 to 10 parts of modified resin, 10 to 30 parts of toughened resin and 1 to 5 parts of a complexing curing agent. A preparation method of the underfiller composition comprises the following steps of: adjusting the temperature of the production environment to 15-28 DEG C and the relative humidity to be less than 70 percent; adding the hydrogenated epoxy resin into a vacuum stirring kettle sequentially according to the formula sequence and stirring; adding the modified resin uniformly and mixing uniformly; adding the curing agent and mixing uniformly; performing vacuum mixing uniformly; defoaming, filtering, split-charging, putting into a storage and performing refrigeration at minus 20 DEG C. The underfill adhesive has low viscosity, can be used for avoiding preheating during use and has high curing speed.
Description
technical field [0001] The invention relates to an adhesive, in particular to an underfill adhesive composition for a flip chip. Background technique [0002] Flip-chip is a leadless structure, which generally contains circuit units. The principle is to deposit tin-lead balls on the I / Opad, and then flip the chip to heat and combine the molten tin-lead balls with the ceramic plate. Flip-chip packaging technology and Compared with the traditional wire bonding process, it has many obvious advantages, such as eliminating the requirement for wire bonding connection, increasing the connection density of input / output (I / O), smaller package size and superior electrical and thermal performance, etc. , Therefore, this technology has replaced conventional wire bonding and has gradually become the mainstream of future packaging technology. [0003] In flip-chip technology, the soldered component materials include different types of organic and inorganic materials, all of which have in...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more