Transient liquid phase diffusion bonding process of molybdenum copper alloy and stainless steel

Abstract

The invention discloses a transient liquid phase diffusion bonding process of molybdenum copper alloy and stainless steel. The transient liquid phase diffusion bonding process comprises the following steps that (1) before welding, the surfaces to be welded of the molybdenum copper alloy and the stainless steel are cleaned, wiped and blown to be dry until the surfaces to be welded show metallic luster; (2) a composite middle layer is added between contacting surfaces to be welded of the molybdenum copper alloy and the stainless steel, and then a workpiece to be welded is put in a vacuum chamber and is pressed tightly through an upper pressing head and a lower pressing head; (3) when the vacuum chamber is vacuumized until the vacuum degree reaches 10-4 Pa, transient liquid phase diffusion welding is carried out on the assembled workpiece made of the molybdenum copper alloy and the stainless steel; (4) cooling is carried out after welding, and the welding workpiece made of the molybdenum copper alloy and the stainless steel is taken out. The transient liquid phase diffusion bonding process of the molybdenum copper alloy and the stainless steel completely achieves diffusion bonding between the molybdenum copper alloy and the stainless steel, can obtain a diffusion bonding connector made of the molybdenum copper alloy and the stainless steel with the shearing strength reaching 120 M Pa, can meet the use requirements of a composite structure made of the molybdenum copper alloy and the stainless steel, and has the advantages of being low in cost, simple, convenient, high in applicability, convenient to popularize and apply and the like.

Description

technical field [0001] The invention relates to a diffusion connection method for molybdenum-copper alloy and stainless steel, in particular to a method for instant liquid phase diffusion connection of molybdenum-copper alloy and stainless steel, which belongs to the technical field of welding of dissimilar materials. Background technique [0002] With the strengthening of the functions of electronic devices, the miniaturization of volume and the increase of power, the requirements for high temperature performance and heat dissipation performance of electronic sealing materials are getting higher and higher. Molybdenum-copper alloy has good electrical and thermal conductivity, relatively stable coefficient of thermal expansion, and appropriate mechanical strength, and can be used at relatively high temperatures. It is highly valued as an electronic sealing material. [0003] When welding molybdenum-copper alloy and stainless steel, due to the large difference in thermophysic...

AI Technical Summary

Problems solved by technology

However, there is a small amount of Fe-Mo intermetallic compounds in the fusion zone on the side of the molybdenum-copper alloy, and the accumulation of these intermetallic compounds limits the high-temperature application of the molybdenum-copper alloy and stainless steel joints

The solder used in vacuum brazing molybdenum-copper alloy and stainless steel mainly includes Ag-Cu-Ti active solder and nickel-based amorphous solder. The cost of these two solders is relatively high, so their application range is greatly limited.