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Silver paste for mobile phone shielding and preparation method thereof

A silver paste, mobile phone technology, applied in conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, electrical components, etc., can solve problems such as large resistance, and achieve the effect of meeting resistance requirements

Active Publication Date: 2013-06-19
SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] High resistance, to meet the European Union's radiation dose requirement of -60DB, the resistance requirement is less than 1 ohm, and the existing silver paste cannot meet these requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A preparation method of silver paste for mobile phone, the method comprises the following steps:

[0035] (1) Prepare materials according to the following components: 45kg of metallic silver powder, 9kg of polymer resin, 0.2kg of adhesion promoter, 2.0kg of thickener, and 43.8kg of solvent. The metal silver powder used is flaky silver powder with a particle size of 7 μm and a tap density of 3.5 g / ml; the polymer resin used is a vinyl chloride copolymer, the adhesion promoter used is a silane coupling agent, and the used thickener The agent is fumed silica, and the solvent used is DBE.

[0036] (2) Preparation of the carrier: Weigh the chlorinated vinegar copolymer and DBE, then pour it into the dissolving kettle, turn on the power and stir it, and after the carrier is transparent, filter it out with a 300-400 mesh cloth. Miscellaneous, get the carrier.

[0037] (3) Preparation of silver paste: Weigh metal silver powder, carrier, adhesion promoter, thickener and solven...

Embodiment 2

[0040] (1) Prepare materials according to the following components: 50kg of metallic silver powder, 8kg of polymer resin, 0.3kg of adhesion promoter, 1.6kg of thickener, and 40.1kg of solvent. The metal silver powder used is flaky silver powder with a particle size of 5 μm and a tap density of 2.85 g / ml; the polymer resin used is a vinyl chloride copolymer, the adhesion promoter used is a silane coupling agent, and the used thickener The agent is fumed silica, and the solvent used is DBE.

[0041] (2) Preparation of the carrier: Weigh the chlorinated vinegar copolymer and DBE, then pour it into the dissolving kettle, turn on the power and stir it, and after the carrier is transparent, filter it out with a 300-400 mesh cloth. Miscellaneous, get the carrier.

[0042] (3) Preparation of silver paste: Weigh metal silver powder, carrier, adhesion promoter, thickener and solvent, place it in a high-speed disperser for high-speed dispersion, and obtain a uniform paste.

[0043] (4)...

Embodiment 3

[0045] (1) Prepare materials according to the following components: 54kg of metallic silver powder, 7kg of polymer resin, 0.3kg of adhesion promoter, 1.5kg of thickener, and 37.2kg of solvent. The metal silver powder used is flaky silver powder with a particle size of 3 μm and a tap density of 2.6 g / ml; the polymer resin used is a vinyl chloride copolymer, the adhesion promoter used is a silane coupling agent, and the used thickener The agent is fumed silica, and the solvent used is DBE.

[0046] (2) Preparation of the carrier: Weigh the chlorinated vinegar copolymer and DBE, then pour it into the dissolving kettle, turn on the power and stir it, and after the carrier is transparent, filter it out with a 300-400 mesh cloth. , to get the carrier.

[0047] (3) Preparation of silver paste: Weigh metal silver powder, carrier, adhesion promoter, thickener and solvent, place it in a high-speed disperser for high-speed dispersion, and obtain a uniform paste.

[0048] (4) Production...

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PUM

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Abstract

The invention relates to silver paste for mobile phone shielding and a preparation method of the silver paste for the mobile phone shielding. The conductive silver paste comprises the following components, by weight, 45%-54% of metal silver powder, 7%-9% of high polymer resin, 0.2%-0.4% of adhesive force accelerant, 0.5%-2.0% of thickener, and 37%-45% of solvent. The production and preparation of the silver paste is completed through carrier preparation, silver paste preparation and production. Compared with the prior art, the preparation method can enable silver paste products to be solidified at 80 DECG in 30 minutes, and a resistance value after solidification is less than 1 ohm, and therefore not only are temperature-resistance requirements of shielding materials satisfied, but also resistance requirements needed by shielding are satisfied.

Description

technical field [0001] The invention relates to a silver paste and a preparation method thereof, in particular to a silver paste for mobile phone shielding and a preparation method thereof. Background technique [0002] According to the latest research from Strategy Analytics, global mobile phone shipments in the second quarter of 2011 increased by 13% compared with the same period last year, reaching 361.1 million units. Nokia saw its biggest decline since 1999, while Apple was close to No. 3 LG. [0003] Alex Spektor, senior analyst at Strategy Analytics commented: "Despite multiple debt crises and economic turmoil around the world, the mobile phone market is still developing well. Global mobile phone shipments in the second quarter of 2011 increased by 13% year-on-year to 361.1 million units. Apple outperformed, shipping a record 20.3 million units. [0004] With the increasing demand for mobile phones, everyone may have a phone call every day, but mobile phones are rad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 朱玉明
Owner SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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