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Apparatus and method used for determining thermal contact resistance in hot stamping process

A technology of contact thermal resistance and hot stamping, applied in the field of hot stamping of high-strength steel plates

Active Publication Date: 2013-04-03
滕州市产品质量监督检验所
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0009] The present invention aims at the problems existing in the devices and methods for testing the thermal contact resistance in the prior art, and designs a device and a method for measuring the thermal contact resistance between the high-temperature steel plate and the mold during the hot stamping process, so as to achieve a certain interface pressure and Test of thermal contact resistance at interface temperature

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  • Apparatus and method used for determining thermal contact resistance in hot stamping process

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Embodiment Construction

[0072] The present invention will be further described below in conjunction with the accompanying drawings.

[0073] A device for measuring the contact thermal resistance between a high-temperature steel plate and a mold during hot stamping, including a pressure applying device, a measuring device and a resistance data acquisition module, the measuring device including a sample measuring tool, a standard module tooling and a standard test tool The sample tooling, the sample measuring tooling, the standard module tooling and the standard sample tooling are respectively connected to the resistance data acquisition module through wires:

[0074] The pressurizing device includes a pressurizing device, an upper workbench and a lower workbench, and the pressurizing device is connected with the upper workbench and the lower workbench respectively; the measuring device includes an upper tooling, a lower tooling and a sample fixing tooling, The upper tooling is fixed on the upper workb...

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Abstract

The invention provides an apparatus used for determining thermal contact resistance between a high-temperature steel plate and a die in the process of hot stamping. The apparatus comprises a pressure applying unit, a determination unit and a resistance data acquisition module, wherein the determination unit comprises a sample determination tool, a standard module tool and a standard sample tool, the sample determination tool, the standard module tool and the standard sample tool are respectively connected with the resistance data acquisition module, the pressure applying unit comprises a pressurization device, an upper workbench and a lower workbench, the pressurization device is respectively connected with the upper workbench and the lower workbench, and the sample determination tool comprises an upper tool, a lower tool and a sample fixing tool. The invention also discloses a method used for determining the thermal contact resistance between the high-temperature steel plate and the die in the process of hot stamping. According to the invention, the thermal contact resistance is indirectly obtained by testing a contact resistance on a contact interface, and the problems of low detection precision and incapability of real-time continuous evaluation of the thermal contact resistance of a contact interface during heat transfer process in testing of thermal contact resistance in the prior art are overcome.

Description

technical field [0001] The invention relates to a measuring device and method for thermal contact resistance, in particular to a testing method and device for thermal contact resistance between steel and a mold during hot stamping, and belongs to the technical field of hot stamping of high-strength steel plates. Background technique [0002] The Inverse Heat Conduction Problem (IHCP) is an ill-posed problem, which is different from the conventional heat conduction process. The conventional heat conduction process is based on the known initial conditions or boundary conditions to solve the temperature change inside the heat transfer body, which is a well-posed problem. IHCP needs to calculate the boundary conditions or initial conditions of the heat transfer body according to the temperature change of the heat transfer body: that is, by installing a thermal sensor inside the heat transfer body, and using the thermal sensor to record the temperature change of the corresponding...

Claims

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Application Information

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IPC IPC(8): G01N13/00
Inventor 李辉平贺连芳赵国群
Owner 滕州市产品质量监督检验所
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