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Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer

A technology of chemical passivation and barrier layer, applied in the field of preparation of barrier layer on copper foil, can solve the problems of poor high temperature oxidation resistance, low peeling resistance, complex preparation method of barrier layer, etc. The effect of excellent copper ion migration resistance and excellent ion migration resistance

Inactive Publication Date: 2013-11-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The present invention aims to solve the technical problems of complex preparation method of the barrier layer on the existing copper foil, poor resistance to ion migration, heat resistance, corrosion resistance, high temperature oxidation resistance and low peel strength of the barrier layer, and provides a copper foil Method for upper displacement plating Ni-S alloy barrier layer and chemical passivation method of the barrier layer

Method used

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  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer
  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer
  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer

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specific Embodiment approach 1

[0028] Embodiment 1: The method for replacing the Ni-S alloy barrier layer on the copper foil of the present embodiment is carried out according to the following steps:

[0029] 1. Preparation of replacement nickel plating: a. The concentration of boric acid is 5-40g / L, the concentration of organic acid or its sodium salt is 0-100g / L, the concentration of sulfur-containing compounds is 7-200g / L, nickel salt The concentration of boric acid, organic acid or its sodium salt, sulfur compound and nickel salt is weighed respectively at 5-150g / L; b, the boric acid weighed in step a is dissolved in deionized water, and then the pH value is pre-adjusted with sulfuric acid to 2.0, to obtain solution A; c, heat the solution A obtained in step b to 50-60°C, then add the sulfur-containing compound weighed in step a, and stir until dissolved to obtain solution B; d, the organic compound weighed in step a Acid or its sodium salt is added to solution B, and the pH value is adjusted to 1.0 to ...

specific Embodiment approach 2

[0033] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the organic acid described in step one is citric acid, lactic acid, malic acid, gluconic acid, propionic acid, adipic acid, succinic acid, glycine, propanoic acid One or a combination of glutamic acid, glutamic acid, and aspartic acid. Others are the same as in the first embodiment.

[0034] When the organic acid is a composition in this embodiment, each composition is combined in arbitrary ratios.

specific Embodiment approach 3

[0035] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the concentration of the electrochemical degreasing liquid described in step two is 10~40g / L according to the concentration of sodium carbonate, and the concentration of trisodium phosphate is 10~40g / L, the concentration of sodium silicate is 2~10g / L, and it is prepared by adding sodium carbonate, trisodium phosphate and sodium silicate into water and mixing them evenly. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a method for displacement plating of a Ni-S alloy barrier layer on a copper foil, and a chemical passivation method of the barrier layer, in particular to a preparation method of the barrier layer on the copper foil, and a passivation method of the barrier layer, aiming at solving the technical problems that the existing preparation method of the barrier layer on the copper foil is complicated, the barrier layer is poor in ion migration resistance, heat resistance, corrosion resistance and high-temperature antioxidation and low in peel strength. The method for displacement plating of the Ni-S alloy barrier layer on the copper foil comprised the steps of: 1. preparing Ni displacement plating solution; 2. pretreating the copper foil; and 3. soaking the copper foil into the Ni displacement plating solution to obtain the Ni-S alloy barrier layer plated on the copper foil. The chemical passivation method comprises the step of soaking the copper foil plated with the Ni-S alloy barrier layer into passivating solution. In Ni-S alloy, the atomic percent of S is 0.1-30%, and the thickness of a passivation layer is 5-30nm. The methods provided by the invention can be used for treating a printed circuit board (PCB).

Description

technical field [0001] The invention relates to a preparation method of a barrier layer on copper foil and a passivation method of the barrier layer. Background technique [0002] Copper foil is the main raw material in the manufacturing process of printed circuit boards (PCB). In today's electronic information age, in order to meet the high density, thinner and development in the direction of corrosion resistance and peel strength. In order to meet the increasing performance requirements, it is necessary to carry out appropriate surface treatment on copper foil to improve the bonding strength between copper foil and substrate, and improve the ion migration resistance, heat resistance, corrosion resistance and high temperature oxidation resistance of copper foil. [0003] In order to prevent the copper from migrating into the insulating matrix and affecting the insulation of the PCB, and to overcome the poor heat resistance, corrosion resistance and high temperature oxidati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/16C23C18/18C23C18/32
Inventor 黎德育田栋李宁肖宁刘瑞卿李冰
Owner HARBIN INST OF TECH
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