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Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer

A technology of chemical passivation and barrier layer, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of low peel strength, complicated preparation method of barrier layer, poor high temperature oxidation resistance, etc., to achieve Improved high temperature resistance to oxidation and discoloration, excellent resistance to copper ion migration, and simple equipment

Inactive Publication Date: 2012-10-17
HARBIN INST OF TECH
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  • Abstract
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  • Application Information

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Problems solved by technology

[0005] The present invention aims to solve the technical problems of complex preparation method of the barrier layer on the existing copper foil, poor resistance to ion migration, heat resistance, corrosion resistance, high temperature oxidation resistance and low peel strength of the barrier layer, and provides a copper foil Method for upper displacement plating Ni-S alloy barrier layer and chemical passivation method of the barrier layer

Method used

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  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer
  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer
  • Method for displacement plating of Ni-S alloy barrier layer on copper foil, and chemical passivation method of barrier layer

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specific Embodiment approach 1

[0028] Specific implementation mode 1: The method of substitution plating Ni-S alloy barrier layer on copper foil of this embodiment is carried out in the following steps:

[0029] 1. The preparation of replacement nickel plating: a. The concentration of boric acid is 5-40g / L, the concentration of organic acid or its sodium salt is 0-100g / L, the concentration of sulfur-containing compounds is 7-200g / L, nickel salt The concentration of 5~150g / L is respectively weighed boric acid, organic acid or its sodium salt, sulfur compound and nickel salt; b. The boric acid weighed in step a is dissolved in deionized water, and then the pH value is adjusted to 2.0 to obtain solution A; c. Heat the solution A obtained in step b to 50-60°C, then add the sulfur-containing compound weighed in step a, and stir to dissolve to obtain solution B; d. The acid or its sodium salt is added to solution B, and the pH value is adjusted to 1.0-6.0 with sulfuric acid or sodium hydroxide solution to obtain sol...

specific Embodiment approach 2

[0033] Specific embodiment two: This embodiment is different from the specific embodiment one in that the organic acids described in step one are citric acid, lactic acid, malic acid, gluconic acid, propionic acid, adipic acid, succinic acid, glycine, and propionic acid. One or a combination of several of acid, glutamic acid and aspartic acid. Others are the same as the first embodiment.

[0034] When the organic acid is a composition in this embodiment, each composition is combined in an arbitrary ratio.

specific Embodiment approach 3

[0035] Specific embodiment three: This embodiment is different from specific embodiment one or two in that the electrochemical degreasing solution described in step two has a sodium carbonate concentration of 10-40g / L and a trisodium phosphate concentration of 10-40g / L, the concentration of sodium silicate is 2-10g / L. Sodium carbonate, trisodium phosphate and sodium silicate are added to water and mixed uniformly. Others are the same as the first or second embodiment.

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Abstract

The invention relates to a method for displacement plating of a Ni-S alloy barrier layer on a copper foil, and a chemical passivation method of the barrier layer, in particular to a preparation method of the barrier layer on the copper foil, and a passivation method of the barrier layer, aiming at solving the technical problems that the existing preparation method of the barrier layer on the copper foil is complicated, the barrier layer is poor in ion migration resistance, heat resistance, corrosion resistance and high-temperature antioxidation and low in peel strength. The method for displacement plating of the Ni-S alloy barrier layer on the copper foil comprised the steps of: 1. preparing Ni displacement plating solution; 2. pretreating the copper foil; and 3. soaking the copper foil into the Ni displacement plating solution to obtain the Ni-S alloy barrier layer plated on the copper foil. The chemical passivation method comprises the step of soaking the copper foil plated with the Ni-S alloy barrier layer into passivating solution. In Ni-S alloy, the atomic percent of S is 0.1-30%, and the thickness of a passivation layer is 5-30nm. The methods provided by the invention can be used for treating a printed circuit board (PCB).

Description

Technical field [0001] The invention relates to a preparation method of a barrier layer on a copper foil and a passivation method of the barrier layer. Background technique [0002] Copper foil is the main raw material in the manufacturing process of printed circuit boards (PCB). In today's electronic information era, in order to meet the high-density, thinner and multilayered PCBs, copper foil is also moving towards having excellent ductility and durability. The direction of corrosion resistance and peel strength. In order to meet the ever-increasing performance requirements, the copper foil must be properly surface treated to increase the bonding strength of the copper foil and the substrate, and improve the ion migration resistance, heat resistance, corrosion resistance and high temperature oxidation resistance of the copper foil. [0003] In order to prevent the migration of copper into the insulating matrix and affect the insulation of the PCB, at the same time to overcome th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/18C23C18/32
Inventor 黎德育田栋李宁肖宁刘瑞卿李冰
Owner HARBIN INST OF TECH
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