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Cyanogen-free Au-Sn alloy electroplating liquid

An alloy electroplating solution, au-sn technology, applied in the field of electroplating, can solve the problems of low current density, low peak current density, slow Sn alloy plating speed, etc., and achieve the effect of smooth coating, good bonding force and increased plating speed

Active Publication Date: 2012-08-22
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Au-Sn electroplating solution under this patent produces Au by electroplating at low current density 5 Sn phase, AuSn phase is formed by electroplating at high current density, and Au is formed due to the corresponding 5 The current density range of the Sn phase is narrow, and the current density is small, so when using the Au-Sn electroplating solution to electroplate the Au-30at.%Sn alloy through the variable amplitude pulse fitting, the selected corresponding electroplating Au 5 The peak current density of the Sn phase is smaller, lower than 2.5μm / h, while the Au 5 The Sn phase accounts for more than half of the entire Au-30at.%Sn alloy, so the plating speed of the electroplated Au-30at.%Sn alloy is slow
In addition, the patent does not indicate whether the plating solution can directly co-deposit Au-30at.%Sn alloy and its plating speed
The above-mentioned patent does not mention the direct deposition of Au-Sn eutectic coating, even if the Au-30at.%Sn alloy is electroplated with variable amplitude pulse, the problem of slow plating speed is not solved

Method used

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  • Cyanogen-free Au-Sn alloy electroplating liquid
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  • Cyanogen-free Au-Sn alloy electroplating liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Electroplating Au-30at.%Sn eutectic coating with reversing pulse, variable amplitude pulse and plating solution of the present invention

[0049] (1) Preparation of Au-Sn alloy electroplating solution

[0050] 1. The composition and content of the plating solution are as follows:

[0051]

[0052] During the electroplating process, the temperature of the plating solution is 45°C, and a pure gold anode is used.

[0053] 2. The preparation steps are as follows:

[0054] 1) To prepare 100ml of gold-tin alloy electroplating solution. Take 40ml of deionized water in a beaker, add 0.012mol of potassium pyrophosphate, 0.001mol of stannous sulfate, 1.5g of hydroquinone, 3g of disodium hydrogen phosphate and 0.05g of cobalt sulfate into the beaker in sequence, and stir evenly.

[0055] 2) Take 40ml of deionized water in a beaker, add 0.048mol of ammonium sulfite, 0.009mol of HEDP, and 0.002mol of monobasic sodium gold sulfite to the beaker in turn, and stir evenly.

[005...

Embodiment 2

[0071] Direct electroplating of Au-30at.% Sn eutectic coating with reversing pulse, variable amplitude pulse, and the composition of the plating solution of the present invention, the composition and parameters of the plating solution:

[0072]

[0073] During the electroplating process, the temperature of the plating solution is 55°C, and platinum and titanium mesh anodes are used for electroplating.

[0074] Plating solution preparation steps are the same as in Example 1.

[0075] The relationship between the composition of the coating and the current density, the surface morphology, thickness and crystal structure of the coating are the same as in Example 1.

[0076] Measured when the peak current density is lower than 15mA / cm 2 When the tin content of the obtained coating is about 50at.%, it is AuSn phase; when the current density is higher than 35mA / cm 2 When the tin content of the coating is close to 16.5at.%, it is Au 5 Sn phase; when the current density is 23mA / c...

Embodiment 3

[0083] Au-Sn alloy coatings (Au-30at.%Sn eutectic, Au-25at.%Sn) with different tin contents are prepared by using positive variable amplitude pulse current and plating solution of the present invention

[0084] Bath composition and parameters:

[0085]

[0086] During the electroplating process, the temperature of the plating solution is 25°C, and the electroplating uses stainless steel anodes.

[0087] Plating solution preparation steps are the same as in Example 1.

[0088] The relationship between the composition of the coating and the current density, the surface morphology, thickness and crystal structure of the coating are the same as in Example 1.

[0089] Measured when the peak current density is lower than 6.5mA / cm 2 When the tin content of the obtained coating is about 50at.%, it is AuSn phase; when the current density is higher than 22mA / cm 2 When the tin content of the coating is close to 15at.%, it is Au 5 Sn phase; when the current density is 16mA / cm 2 Wh...

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Abstract

The invention relates to cyanogen-free Au-Sn alloy electroplating liquid, which belongs to the field of electroplating. The cyanogen-free Au-Sn alloy electroplating liquid comprises following components including non-cyanogen soluble monovalence gold salt, sulfite, organic polybasic acid, soluble divalent tin salt, pyrophosphate, a tin ion oxidation inhibitor, dihydric phosphate and cobalt salt. The electroplating liquid is stable, electroplating speed is fast, operation is simple, Au-Sn alloy ingredients are easy to be controlled, and the cyanogen-free Au-Sn alloy electroplating liquid is applicable to production.

Description

technical field [0001] The invention relates to a cyanide-free Au-Sn alloy electroplating solution, which belongs to the field of electroplating. Background technique [0002] Au-30at.%Sn eutectic alloy has good thermal conductivity, electrical conductivity, wettability, corrosion resistance, creep resistance, and no need for flux in welding. It is used in microelectronic device packaging, chips and circuit substrates. It is widely used in the connection of materials and in the hermetic packaging of high-reliability circuits. For example, in the high-power light-emitting diode (LED) flip-chip manufacturing technology, Au-30at.%Sn eutectic alloy can be used to make bumps on the chip, improve the heat dissipation performance of the LED, and improve the reliability of the LED. [0003] Compared with evaporation, sputtering or electroless plating, co-deposition electroplating method to prepare Au-30at.%Sn eutectic alloy has low cost, high production efficiency, suitable for com...

Claims

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Application Information

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IPC IPC(8): C25D3/62C25D3/60
Inventor 黄明亮潘剑灵赵宁马海涛赵杰
Owner DALIAN UNIV OF TECH
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