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Special water-based cutting fluid for diamond wire saw

A technology of wire saw and diamond, applied in the direction of lubricating composition, etc., can solve the problem of difficult recycling, and achieve the effects of easy recycling, good cooling and long service life

Inactive Publication Date: 2012-03-21
JIANGSU KAIXING PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the cutting process of silicon ingots, cutting chips or cutting chips, especially fine powder chips, will be produced. Although the value of such chips, namely silicon powder and waste silicon wafers generated during cutting, is very high, it is difficult to recycle because The silicon powder produced by cutting and the abrasive grain (such as SiC) are closely mixed together in the cutting fluid

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Embodiment 1: a kind of special water base cutting fluid for diamond wire saw, its component and weight percent are:

[0051] A, selective dispersant is polycarboxylate, and its weight percentage is 0.01%;

[0052] B. The selective wetting agent is an anionic wetting agent, and the anionic wetting agent is acrylic acid amino acid, and its weight percentage is 0.01% to 3%;

[0053] C, selective defoamer is dimethyl polysiloxane, and its weight percentage is 0.05%;

[0054] D, selective corrosion inhibitor is alkanolamine, and its weight percentage is 0.01%;

[0055] E, selective chelating agent is ethylenediaminetetraacetic acid (EDTA), and its weight percentage is 0.01%;

[0056] F, selective bactericide is triazine, and its weight percentage is 0.01%;

[0057] The composition and weight percent of G, selective penetrating agent are:

[0058] 93% thickener, 4% dye, 3% essence, among which, the thickener is xanthan gum,

[0059] The weight percentage of penetrating ...

Embodiment 2

[0061] Embodiment 2: a kind of special water base cutting fluid for diamond wire saw, its component and weight percent are:

[0062] A, selective dispersant is polycarboxylate, and its weight percentage is 2%;

[0063] B, selective wetting agent is anionic wetting agent, and described anionic wetting agent is acrylic acid amino acid, and its weight percentage is 3%;

[0064] C, selective defoamer is dimethyl polysiloxane, and its weight percentage is 2%;

[0065] D, selective corrosion inhibitor is alkanolamine, and its weight percentage is 2%;

[0066] E, selective chelating agent is ethylenediaminetetraacetic acid (EDTA), and its weight percentage is 2%;

[0067] F, selective bactericide is triazine, and its weight percentage is 2%;

[0068] The composition and weight percent of G, selective penetrating agent are:

[0069] Thickener 95%, dyestuff 4%, essence 1%, wherein, the thickener is xanthan gum, and the weight percent of penetrating agent is 2%;

[0070] The remain...

Embodiment 3

[0071] Embodiment 3: a kind of special water base cutting fluid for diamond wire saw, its component and weight percent are:

[0072] A, selective dispersant is polycarboxylate, and its weight percentage is 1.5%;

[0073] B. The selective wetting agent is an anionic wetting agent, and the anionic wetting agent is acrylic acid amino acid, and its weight percentage is 1.1%;

[0074] C, selective defoamer is dimethyl polysiloxane, and its weight percentage is 0.8%;

[0075] D, selective corrosion inhibitor is alkanolamine, and its weight percentage is 0.8%;

[0076] E, selective chelating agent is ethylenediaminetetraacetic acid (EDTA), and its weight percentage is 1.1%;

[0077] F, selective bactericide is triazine, and its weight percentage is 0.7%;

[0078] The composition and weight percent of G, selective penetrating agent are:

[0079] Thickener 94%, dye 5%, essence 1%, wherein, the thickener is xanthan gum, and the weight percentage of penetrating agent is 1.0%;

[008...

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Abstract

The invention relates to a special water-based cutting fluid for diamond wire saw comprising the following components in percentage by weight: 0.01% of dispersing agent, 0.01-3% of wetting agent, 0.05% of defoaming agent, 0.01% of corrosion inhibitor, 0.01% of chelating agent, 0.01% of bactericide, 0.01% of penetrating agent and the balance of water. The invention has the advantages of extremely lower viscosity, good cooling property and good chip suspension and diffusivity; in addition, silicon grains of chip grains can be greatly wetted, the diamond wire saw is cleaned clearly, has low foaminess, is not sensitive to metal ions and can not be combusted. The special water-based cutting fluid disclosed by the invention is stable during use at high temperature and has longer service life and higher cutting efficiency; and in addition, the cutting fluid left on the silicon chips is easy to be removed, and the recovery of silicon powder turns to be very easy.

Description

Technical field: [0001] The invention relates to a water-based cutting fluid matched with a diamond wire saw and a method for cutting brittle materials with the water-based cutting fluid. Background technique: [0002] In the semiconductor industry, wire saws are commonly used to cut hard and brittle ingots of silicon into the desired wafers. In order to improve cutting efficiency and cutting quality, cutting fluid must be used during cutting, and cutting fluid containing abrasive grains must be used when cutting with a wire saw. Existing cutting fluids are composed of suspension liquid and grinding grains. The grinding grains are silicon carbide (SiC). It can be evenly dispersed, so that the performance of the wire saw is better. A key factor in ensuring better dispersion and suspension of the ground grains is the viscosity of the cutting fluid. The higher the viscosity, the harder it is to satisfy the uniformity of the dispersion, but the better the stability of the sus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02
Inventor 梅怀伦
Owner JIANGSU KAIXING PLASTICS
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