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Resin for alkali-soluble binder and photosensitive resin composition containing the resin

A binder and alkali-soluble technology, which is applied in the field of photosensitive resin compositions containing the resin, can solve the problems of foreign matter generated on the substrate and the decrease of product yield, and achieve the effect of improving the processability.

Active Publication Date: 2015-04-15
株式会社易美太
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, when the solubility of the resin composition to the main solvent (generally referred to as resolvability) is low, the photosensitive resin composition dried at the nozzle part continues to exist in the form of protrusions, and foreign matter is generated in the substrate , resulting in a decrease in product yield

Method used

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  • Resin for alkali-soluble binder and photosensitive resin composition containing the resin
  • Resin for alkali-soluble binder and photosensitive resin composition containing the resin
  • Resin for alkali-soluble binder and photosensitive resin composition containing the resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] Combine 5g of the alkali-soluble resin (1) formed in Synthesis Example 1 with 30g of green pigment dispersion, 1.5g of photoinitiator I-369, 0.5g of photoinitiator CGI-242, and 3.5g of dipentaerythritol hexaacrylate , 40 g of propylene glycol monomethyl ether acetate and 0.1 g of 2-methacryloxypropyl trimethoxysilane (ie additives) were mixed and stirred for about 1 hour, thereby preparing a photosensitive resin composition.

Embodiment 2

[0106] Except that 5 g of the alkali-soluble resin (2) formed in the synthesis example 2 was used instead of the alkali-soluble resin (1) in Example 1, the mixture was mixed with the same composition as in Example 1, and stirred for approximately 1 hour to prepare a photosensitive resin composition.

experiment example 1-

[0109]

[0110] The photosensitive resin composition solutions prepared in Example 1, Example 2 and Comparative Example 1 were spin-coated on a glass substrate, and then pre-baked at 90° C. for 100 seconds to prepare a conductive film with a thickness of 1.5 μm. The film was maintained at an exposure gap of 200μm with a photomask, and a high-pressure mercury lamp was used at 60mJ / cm 2 After exposure to the energy of, the substrate was developed with a 0.04% KOH aqueous solution at 25°C for 60 seconds. After the development step, washing and drying are performed and post-baking in a convection heat transfer furnace at 230°C for 25 minutes. Next, monitor the pattern state.

[0111] An optical microscope is used to monitor the state of each pattern. The development characteristics, sensitivity and NMP solution resistance of the patterns were measured and compared as shown in Table 1 below.

[0112] The development characteristics were measured by monitoring the development of the ex...

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Abstract

PURPOSE: An alkali soluble binder resin is provided to minimize the contamination of a slit nozzle and the foreign materials on a substrate due to excellent solubility to a cleaning solvent and to improve processability since a repetitive cleaning process. CONSTITUTION: An alkali soluble binder resin comprises repeating unit represented by chemical formulas 1 ~3. In chemical formula 1, X1 is selected from hydrogen, C1~3 alkyl group, and alkoxy group; A is a benzyloxycarbonyl group, phenyl group, isobonyl group, cyclohexyl group, and N-phenylmaleimide group. In chemical formula 2, X1 and X2 are selected from hydrogen, C1~3 alkyl group, and alkoxy group; Y is selected from the group consisting of C1~5 alkylene, ethylene oxide and propylene oxide; and n is 1~10. In chemical formula 3, X1 and X2 are selected from hydrogen, C1~3 alkyl group, and alkoxy group; Y is selected from the group consisting of C1~5 alkylene, ethylene oxide and propylene oxide; Z is selected from C1~5 alkylene, cyclohexene, cyclohexane and benzene group; and n is 1~10.

Description

Technical field [0001] The present invention relates to an alkali-soluble binder resin that has excellent resolubility of a cleaning solvent and can minimize the contamination of slit nozzles and the generation of foreign substances in a substrate, and a method of manufacturing the resin, and a A photosensitive resin composition containing the resin. Background technique [0002] The method of preparing a color filter using a conventional photosensitive resin composition gradually changes from an existing spin coating method to a slit and spin method or a spinless method as the substrate size increases. However, in the slit rotation method or the non-rotation method, a slit nozzle is used for coating. Therefore, the slit nozzle is likely to be contaminated by the photosensitive resin composition, and a method for cleaning the slit nozzle is required. [0003] This cleaning method uses the main solvent in the photosensitive resin composition to clean the nozzle portion of the slit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/32C08F8/00C08F8/14C08G81/02G03F7/032G03F7/033
Inventor 许闰姬梁承秦金韩修赵昌镐金善花郑元镇
Owner 株式会社易美太
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