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Polymer matrix composite material and production method of polymer matrix composite material

A technology of polymer materials and composite materials, applied in the field of polymer-based composite materials, can solve the problems of difficult preparation of electronic insulation packaging materials, etc., and achieve the effects of easy control of operating parameters, low dielectric loss, and simple process

Active Publication Date: 2011-09-14
DONGGUAN HUAKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a polymer-based composite material, so as to solve the defect in the prior art that it is difficult to prepare electronic insulating packaging materials with high thermal conductivity from composite materials based on polymer materials

Method used

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  • Polymer matrix composite material and production method of polymer matrix composite material
  • Polymer matrix composite material and production method of polymer matrix composite material
  • Polymer matrix composite material and production method of polymer matrix composite material

Examples

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preparation example Construction

[0046] see figure 1 Shown, the preparation method of polymer-based composite material of the present invention comprises the following steps:

[0047] A metal is provided; the metal can be aluminum, chromium, nickel, iron, molybdenum, cobalt, tungsten, tantalum, niobium or other alternative metal materials.

[0048] The metal is crushed into micron-scale metal powder and nano-scale metal powder; the particle size of the micron-scale metal powder is 1 micron to 20 microns; the particle size of the nano-scale metal powder is about 10 nm to 100 nm Nano.

[0049] Passivation treatment is carried out on micron-scale metal powder and nano-scale metal powder, so that both micron-scale and nano-scale metal powder are in a passivated state; the passivation treatment is based on the surface of these metal powders Forming an oxide layer can be achieved by air heating oxidation, strong oxidant oxidation or other alternative methods; wherein the air heating oxidation method is to place t...

Embodiment 1

[0055] Embodiment 1 The present invention utilizes aluminum metal to prepare the method for reinforcing material

[0056] The process steps of preparing the reinforcement in this embodiment are mainly to use aluminum metal powders with different particle sizes, passivation treatment and chemical dispersion treatment, and then mix them in an appropriate proportion to form the aluminum reinforcement.

[0057] 1. Provide an aluminum metal material, which is determined to be pure aluminum without any impurities by X-ray diffraction (XRD) test; the aluminum metal material is pulverized into micron-sized aluminum powder with a particle size of about 5 microns body and nano-scale aluminum powder with a particle size of about 50 nanometers.

[0058] 2. Take 10g of pulverized micron-sized aluminum powder for passivation treatment; the passivation treatment is to dry in an aerobic environment at 120°C for 24 hours to form an oxide layer on the surface of the micron-sized aluminum powder...

Embodiment 2

[0062] Embodiment 2 The present invention utilizes the method for preparing reinforcing material of aluminum metal

[0063] The process steps of preparing the reinforcement in this embodiment are mainly to use aluminum metal powders with different particle sizes, passivation treatment and chemical dispersion treatment, and then mix them in an appropriate proportion to form the aluminum reinforcement.

[0064] 1. Provide an aluminum metal material, which is determined to be pure aluminum without any impurities by X-ray diffraction (XRD) test; the aluminum metal material is pulverized into micron-sized aluminum powder with a particle size of about 1 micron body and nano-scale aluminum powder with a particle size of about 10 nanometers.

[0065] 2. Take 10g of pulverized micron-sized aluminum powder for passivation treatment; the passivation treatment is to dry in an aerobic environment at 120°C for 24 hours to form an oxide layer on the surface of the micron-sized aluminum powde...

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Abstract

The invention relates to a polymer matrix composite material which contains: a base material formed by polymer material, and a reinforced material dispersed in the base material, wherein the reinforced material contains micron level metal powder and nanometer level metal powder, and the powders appears in passivation state after passivated. The volume percent of the base material is 50-90%, the volume percent of the reinforced material is 10-50%, and the volume percent is based on the overall volume. By adding the reinforced material prepared with the mixture of passivated micro level and nanometer level metal powders to the base material according to a proper volume rate, the thermal conduction property of material can be effectively promoted and the aim of maintaining the property of low dielectric losses can be achieved.

Description

technical field [0001] The invention relates to the technical field of electronic composite materials, in particular to a polymer-based composite material in which passivated metal particles with different particle sizes are doped into a polymer substrate to improve thermal conductivity. Background technique [0002] With the rapid development of microelectronics technology and printed circuit board assembly technology, coupled with the demand for light, thin, small, multi-functional and high-speed products, the components of electronic devices are bound to face problems such as small internal space and difficulty in heat dissipation, resulting in high temperature during operation of electronic devices. Elevated, so that the operating stability is not good, and even reduce the service life. Using materials with good thermal conductivity in the manufacturing process as much as possible is one of the measures to solve such technical problems. Therefore, the development of ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K9/10C08K3/08C08L27/16C08L23/06C08L23/12C08L33/12C08L79/08C08L63/00H01L23/29
Inventor 汪宏周永存向锋李可铖喻科陈惠如
Owner DONGGUAN HUAKE ELECTRONICS
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