Whole blood centrifugal separation chip and preparation method thereof
A centrifugal separation and chip technology, applied in the field of micro-electromechanical systems, can solve the problems of large consumption of sample biochemical reagents, restricting the development of biochemical analysis, and difficulty in realizing automation, etc., and achieve the effect of compact structure, reduced total area, and short time consumption
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Embodiment 1
[0064] Embodiment 1: Process a centrifugal separator on a silicon wafer
[0065] The structure of this embodiment is shown in Figure 1, and the process flow is shown in figure 2 .
[0066] 1) The process flow of the silicon wafer structure of the chip:
[0067] (a) processing and cleaning the silicon wafer 8;
[0068] (b) Throwing the photoresist 9 on the front side of the silicon wafer, pre-baking, photolithography, developing, and post-baking;
[0069] (c) In-depth etching (ICP) of about 100 μm of silicon on the front side of the silicon wafer to form a microfluidic channel 4, a micro column fence 5, 6, an inlet 2, and three outlets 3;
[0070] 2) Chip cover polymer process:
[0071] (d) process and clean the silicon wafer 8, and apply a release agent 10 on its surface;
[0072] (e) Pour the bubble-free silicon rubber photoresist (PDMS) 11 into the petri dish, let it stand for flattening, and then bake it in an oven at 80°C for about 1 hour;
[0073] (f) Cut the cured ...
Embodiment 2
[0075] Example 2: Fabrication of centrifugal separators from polymers
[0076] The structure of the present embodiment is shown in Fig. 1, and the process flow is shown in the appended image 3 .
[0077] 1) Process flow of polymer structure of separator:
[0078] (a) processing and cleaning the silicon wafer 8;
[0079] (b) Throwing the photoresist 9 on the front side of the silicon wafer, pre-baking, photolithography, developing, and post-baking;
[0080] (c) In-depth etching (ICP) of about 100 μm of silicon on the front side of the silicon wafer to form microfluidic channels 4, micro column fences, sample inlets and sample outlets;
[0081] (d) Process and clean the silicon structure mold 13, and apply a release agent 10 on its surface, pour the bubble-free PDMS 11 on the silicon structure mold 13, and let it stand for flattening, then bake in an oven at 80°C Bake for about 1 hour;
[0082] (e) peel off the cured PDMS from the silicon mold 13, and cut each unit;
[00...
Embodiment 3
[0088] Embodiment 3: the centrifugal separator of sandwich structure
[0089] The technological process of this embodiment sees Figure 4 .
[0090] (a) processing and cleaning the silicon wafer 8;
[0091] (b) Throwing the photoresist 9 on the front side of the silicon wafer, pre-baking, photolithography, developing, and post-baking;
[0092] (c) In-depth etching (ICP) of about 50 μm of silicon on the front side of the silicon wafer to form a microfluidic channel 4, a micro column fence, an inlet 2, and an outlet 3 (similar in structure to method 1);
[0093] (d) the front side of the silicon wafer is anodically bonded to the glass 15;
[0094] (e) Thinning the silicon wafer on the back side of the silicon glass sheet after bonding, the method of dry method, wet method or CMP can be adopted;
[0095] (f) Photoresist removal on the back of the silicon wafer, pre-baking, photolithography, development, and post-baking;
[0096] (g) Deeply etch the inlet and outlet sample po...
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