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Diamond fret saw and manufacture method thereof

A technology of diamond wire saw and diamond particles, which is applied in the direction of metal sawing equipment, stone processing equipment, metal processing equipment, etc., and can solve the problems of abrasive grain holding force to be further improved, diamond initial holding force, and short service life of saw wire and other problems, to achieve the effect of improving processing efficiency, increasing service life and high cutting efficiency

Active Publication Date: 2011-08-31
盛利维尔(常州)金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above two methods, there is the problem of the initial holding force of the diamond, which determines that a very low moving speed of the steel wire must be adopted, resulting in the disadvantages of low production efficiency and high production cost.
Moreover, the diamond wire saw produced by the existing electroplating process still has the disadvantages of the holding force of abrasive grains to be further improved, and the service life of the saw wire is relatively short.

Method used

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  • Diamond fret saw and manufacture method thereof
  • Diamond fret saw and manufacture method thereof
  • Diamond fret saw and manufacture method thereof

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no. 1 approach

[0038] Combine below Figure 1a A method of manufacturing a diamond wire saw according to an embodiment of the present invention is described.

[0039] 1) Provide the core wire.

[0040] The core wire can be made of high carbon steel, such as steel 77, steel 82, steel 92 and so on. Wherein, the diameter of the core wire is 0.7mm.

[0041] In a specific example of the present invention, the surface of the carbon steel wire as the core wire is treated to remove the passivation layer, thereby improving the bonding strength between the core wire and the soft copper layer.

[0042] 2) Forming an intermediate layer on the surface of the core wire to obtain a metal wire.

[0043] In this embodiment, the intermediate layer is composed of a soft copper layer.

[0044] Specifically, the formation of the intermediate layer is achieved by the following steps.

[0045] In some specific examples of the present invention, it is carried out under an inert atmosphere, using a copper melt a...

no. 2 approach

[0061] Combine below Figure 2a A method of manufacturing a diamond wire saw according to an embodiment of the present invention is described.

[0062] 1) Provide the core wire.

[0063] It is the same as the first embodiment, and its description is omitted here.

[0064] 2) Forming an intermediate layer on the surface of the core wire to obtain a metal wire.

[0065] In this embodiment, the intermediate layer is composed of a soft copper layer and a hard layer covering the surface of the soft copper layer. Specifically, the formation of the intermediate layer is achieved by the following steps.

[0066] 2-a) Form a soft copper layer on the surface of the core wire.

[0067] In a specific example of the present invention, a soft copper layer is formed on the surface of the core wire by electroplating copper. Specifically, the core wire is used as the cathode, acidified copper sulfate or acidified copper pyrophosphate is used as the electrolyte solution (copper sulfate con...

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Abstract

The invention discloses a diamond fret saw and a manufacture method thereof. The diamond fret saw comprises a metal base line body and diamond particles embedded on the surface of the metal base line body, wherein the metal base line body comprises a core body, a sand-planting layer and a nickel base layer, wherein the core body consists of carbon steel and has a diameter of 0.1-0.4mm; the sand-planting layer covers the surface of the core body and has a thickness of 0.001-0.04mm; and the nickel base layer covers the surface of the sand-planting layer and has a thickness of 0.001-0.05mm, the nickel layer comprises nickel or a first nickel alloy, the first nickel alloy comprises one or more of Co, W, Fe, Al, Mo, Nb, Si, Ti, V, Y or Zr, and a groove is formed on the surface of the sand-planting layer and is internally provided with the diamond particles. By using the diamond fret saw disclosed by the embodiment of the invention, because the sand-planting layer with the groove covers outside a steel wire, processing rate of electroplating the diamond particles can be increased and service life of the diamond fret saw can be remarkably prolonged.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a diamond wire saw for cutting wafers and a preparation method thereof. Background technique [0002] When manufacturing various semiconductor devices, raw material ingots containing single crystal, polycrystalline or amorphous silicon, sapphire, etc. are cut into thin plates or wafers of predetermined thickness through slicing. [0003] With the rapid development of the electronics industry, the application of wafers has become more and more extensive, and wafer processing technology has also received more and more attention. Among them, wafer cutting is an important process that restricts the yield of subsequent processes. [0004] The wire saw cutting methods currently available for hard and brittle materials such as silicon crystals mainly include cutting using free abrasives and cutting using fixed abrasives. In the cutting process of semiconductor materials such as silicon ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B23D65/00C25D3/56C25D15/00C23C2/04C23C2/38C25D3/38C25D7/06
Inventor 李园
Owner 盛利维尔(常州)金属材料有限公司
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