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Miniature high-voltage capacitor and making method thereof

A high-voltage capacitor and miniature technology, which is applied in the direction of capacitors, fixed capacitors, fixed capacitor electrodes, etc., can solve the problems of internal electrode compactness and continuity, etc., achieve good market application prospects, weaken electrode edge effects, and ensure compactness and The effect of continuity

Inactive Publication Date: 2011-05-11
有研科技集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the single-layer paste internal electrodes of traditional ceramic capacitors are easy to manufacture and low in cost, the inherent shortcomings of the sintered residual pores of the paste electrodes are difficult to overcome, and the compactness and continuity of the internal electrodes are difficult to guarantee.

Method used

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  • Miniature high-voltage capacitor and making method thereof
  • Miniature high-voltage capacitor and making method thereof
  • Miniature high-voltage capacitor and making method thereof

Examples

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Embodiment 1

[0046] figure 1 It is a schematic cross-sectional view of a miniature high-voltage capacitor in the present invention, figure 2 It is a three-dimensional schematic diagram of a miniature high-voltage capacitor in the present invention, wherein 10 is an AB type epoxy resin material, 20 is a glass ceramic disc, 30 is an inner electrode of a gold film, 40 is a silver paste transition electrode, and 50 is an In-Sn50 alloy sheet, 60 is the outer electrode terminal of the red copper sheet.

[0047] Analytical pure Na 2 CO 3 , PbO, Nb 2 o 5 , SiO 2 The raw material powder is mixed evenly according to the ratio of 2:2:3:6 and melted at 1400°C for 2 hours. The melt is cast into a block glass body with a size of about 25mm×25mm×3mm in a preheated steel mold, and the stress is relieved. After annealing for 3 hours, a colored transparent glass body was obtained. The glass body is nucleated and crystallized at different temperatures, that is, nucleated and crystallized at 700°C, 75...

Embodiment 2

[0049] Analytical pure Na 2 CO 3 , PbO, Nb 2 o 5 , SiO 2 The raw material powder is mixed evenly according to the ratio of 1:1:2:3, and then melted at 1400°C for 2 hours. The melt is cast into a block glass body with a size of about 25mm×25mm×3mm in a preheated steel mold, and the stress is relieved. After annealing for 3 hours, a colored transparent glass body was obtained. The glass body was nucleated and crystallized at different temperatures (700°C, 750°C, 800°C, 850°C, 900°C) for 3 hours to obtain glass ceramics, and then trimmed, sliced, spheronized, ground and polished to obtain a diameter of Φ20± The thickness of 0.01mm is 0.50±0.01mm, and the surface is polished (smoothness is higher than Ra0.1). After testing, the dielectric constant of glass ceramics obtained at different crystallization temperatures varies with the test frequency. Figure 4 shown. Select a piece of glass ceramic disc 20 with a dielectric constant of about 350 and a crystallization temperature...

Embodiment 3

[0051] Analytical pure Na 2 CO 3 , PbO, Nb 2 o 5 , SiO 2 The raw material powder is mixed evenly according to the ratio of 2:2:3:6 and melted at 1400°C for 2 hours. The melt is cast into a block glass body with a size of about 25mm×25mm×3mm in a preheated steel mold, and the stress is relieved. After annealing for 3 hours, a colored transparent glass body was obtained. The glass body is nucleated and crystallized at different temperatures (700°C, 750°C, 800°C, 850°C, 900°C) for 3 hours to obtain glass ceramics, and then trimmed, sliced, rounded, ground and polished to obtain a diameter of Φ5±0.01mm in thickness 0.50±0.01mm, the surface is polished (smoothness is higher than Ra0.1) discs, after testing, the dielectric constant of glass ceramics obtained at different crystallization temperatures varies with the test frequency distribution as follows Figure 4 shown. Select a piece of glass ceramic disc 20 with a dielectric constant of about 170 and a crystallization temper...

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Abstract

The invention relates to a miniature high-voltage capacitor and a making method thereof. A dielectric layer is made of glass-ceramic materials, an electrode comprises a gold film inside electrode, a silver paste transition electrode, an In-Sn 50 alloy slice and an outside electrode end of a red copper sheet in sequence from inside to outside, and encapsulating material is epoxy resin. The invention provides the miniature high-voltage capacitor which has the diameter phi of 10-25mm, the thickness of 1-2mm, the nominal capacitance of 10pF-1nF, the rated direct-current voltage 10-20kV and the temperature characteristic of X7R. In the capacitor, the volume is greatly reduced, and an inside and outside electrode design technology is adopted, thereby ensuring the compactness and the continuity of the inside electrode, also weakening the electrode edge effect, enhancing the voltage-resisting strength of the capacitor, eliminating the influence of brittle fracture of lamellar medium materials caused in the welding process and supplying a novel design idea and making method for miniaturization and slice for the high-voltage capacitor.

Description

technical field [0001] The invention relates to a miniature high-voltage capacitor and a preparation method thereof, in particular to a miniature high-voltage capacitor with glass ceramic material as a dielectric and a preparation method thereof. Background technique [0002] With the development of the electronic industry's demand for chip high-voltage capacitors, the trend of "miniaturization" and "thinning" of high-voltage capacitors drives people to conduct in-depth research and development on the dielectric materials and internal and external electrode structures that make up capacitors. [0003] Traditional sintered ferroelectric ceramic materials can obtain high dielectric constant, which has material advantages in the preparation of large-capacity capacitors, especially chip multilayer ceramic capacitors (MLCC) based on it have been widely used. However, due to the many inherent defects such as remaining pores in sintered ceramics, its breakdown strength is relativel...

Claims

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Application Information

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IPC IPC(8): H01G4/00H01G4/005H01G4/08H01G4/224
Inventor 杜军罗君王磊唐群朱君张庆猛章林文谢卫平李洪涛王勐
Owner 有研科技集团有限公司
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