Halogen-free and cleaning-free soldering flux for lead-free solder
A lead-free solder and flux technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of increasing solid content, adding more rosin, and increasing residues, so as to achieve full and smooth solder joints. The effect of high surface insulation resistance and no environmental pollution
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Embodiment 6
[0028] The organic solvent described in embodiment 6 is diethylene glycol ethyl ether and propylene glycol methyl ether, and the weight ratio of the two is 4: 1; Described organic acid active agent is phthalic acid, palmitic acid and racemic malic acid, The ratio of the three is 1:1:1; the halogen-free surfactant is emulsifier OP-10 and triethanolamine, and the weight ratio of the two is 2:1; the rosin is disproportionated rosin, partially polymerized rosin , hydrogenated rosin glyceride and pentaerythritol rosin ester, the weight ratio of the four is 1:1:1:1. The fatty acid ester wetting agent is benzyl acetate and dimethyl succinate, and the weight ratio of the two is 3:2.
Embodiment 7
[0029] The organic solvent described in Example 7 is tetrahydrofurfuryl alcohol; the organic acid activator is palmitic acid; the halogen-free surfactant is emulsifier OP-10, and the rosin is hydrogenated rosin, acrylic rosin And maleic rosin, the weight ratio of the three is 2:1:1. , the fatty acid ester wetting agent is diethyl succinate and dimethyl glutarate, the weight ratio of the two is 2:1.
Embodiment 8
[0030] The organic solvent described in Example 8 is 2-methyl-hexanediol, the organic acid active agent is racemic malic acid, and the halogen-free surfactant is emulsifier OP-10 and triethanolamine, both The weight ratio of the two is 3:1; the rosin is polymerized rosin and hydrogenated rosin, and the weight ratio of the two is 1:1; the fatty acid ester wetting agent is dimethyl adipate, ethyl benzoate and benzyl benzoate, the weight ratio of the three is 1:2:1.
[0031] Put all the components weighed in Examples 1-8 into the flux reactor, stir for 100-120 minutes until all the components are dissolved, and then obtain the halogen-free no-cleaning for lead-free solder described in Examples 1-8 flux.
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