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Halogen-free and cleaning-free soldering flux for lead-free solder

A lead-free solder and flux technology, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of excessive rosin addition, increased residue, increased solid content, etc., to achieve high surface insulation resistance, The solder joints are full and smooth, and the effect of not polluting the environment

Inactive Publication Date: 2010-06-16
上海一远电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flux passes standard reflow soldering. Although the solder joints are full and the surface is bright after soldering, the proportion of rosin in the flux reaches 10% to 17%. If too much rosin is added, the corresponding solid content increases, the residue after soldering increases, and the smoke is relatively thick. Many, just a certain amount of residue left, but can meet the quality requirements of some products without cleaning, "no-cleaning" flux is not really "no-cleaning" flux

Method used

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  • Halogen-free and cleaning-free soldering flux for lead-free solder
  • Halogen-free and cleaning-free soldering flux for lead-free solder
  • Halogen-free and cleaning-free soldering flux for lead-free solder

Examples

Experimental program
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Effect test

Embodiment 6

[0028] The organic solvent described in embodiment 6 is diethylene glycol ethyl ether and propylene glycol methyl ether, and the weight ratio of the two is 4: 1; Described organic acid active agent is phthalic acid, palmitic acid and racemic malic acid, The ratio of the three is 1:1:1; the halogen-free surfactant is emulsifier OP-10 and triethanolamine, and the weight ratio of the two is 2:1; the rosin is disproportionated rosin, partially polymerized rosin , hydrogenated rosin glyceride and pentaerythritol rosin ester, the weight ratio of the four is 1:1:1:1. The fatty acid ester wetting agent is benzyl acetate and dimethyl succinate, and the weight ratio of the two is 3:2.

Embodiment 7

[0029] The organic solvent described in Example 7 is tetrahydrofurfuryl alcohol; the organic acid activator is palmitic acid; the halogen-free surfactant is emulsifier OP-10, and the rosin is hydrogenated rosin, acrylic rosin And maleic rosin, the weight ratio of the three is 2:1:1. , the fatty acid ester wetting agent is diethyl succinate and dimethyl glutarate, the weight ratio of the two is 2:1.

Embodiment 8

[0030] The organic solvent described in Example 8 is 2-methyl-hexanediol, the organic acid active agent is racemic malic acid, and the halogen-free surfactant is emulsifier OP-10 and triethanolamine, both The weight ratio of the two is 3:1; the rosin is polymerized rosin and hydrogenated rosin, and the weight ratio of the two is 1:1; the fatty acid ester wetting agent is dimethyl adipate, ethyl benzoate and benzyl benzoate, the weight ratio of the three is 1:2:1.

[0031] Put all the components weighed in Examples 1-8 into the flux reactor, stir for 100-120 minutes until all the components are dissolved, and then obtain the halogen-free no-cleaning for lead-free solder described in Examples 1-8 flux.

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Abstract

The invention relates to a halogen-free and cleaning-free soldering flux for a lead-free solder, belongs to the technical field of PCB soldering of the electronic industry, and solves the problem that dielectric residues are maintained on a printed board soldered by using the prior soldering flux. The halogen-free and cleaning-free soldering flux for the lead-free solder comprises the following components according to part by weight: 1-5 parts of rosin, 75-90 parts of organic solvent, 1-10 parts of organic acid activating agent, 0.01-1 part of halogen-free surfactant and 0.01-1 part of antioxidant. The halogen-free and cleaning-free soldering flux for the lead-free solder in the invention has low solid content, small rosin content, high surface insulation resistance, and replete and smooth solder joint, is free from corrosion and halogen, has no toxicity and strong penetrating odor, and does not pollute environment basically. Residues are hardly remained on the surface of a PCB soldered by the soldering flux.

Description

technical field [0001] The invention relates to a flux, in particular to a halogen-free no-cleaning flux for lead-free solder and belongs to the technical field of PCB welding in the electronic industry. Background technique [0002] Flux is a chemical substance that can help and promote the soldering process in the soldering process, and at the same time has a protective effect and prevents oxidation reactions. Flux can be divided into solid, liquid and gas. Flux mainly has the functions of "assisting heat conduction", "removing oxides", "reducing the surface tension of the material to be welded", "removing oil stains on the surface of the material to be welded, increasing the welding area", and "preventing re-oxidation". There are two key functions in these aspects: "removing oxides" and "reducing the surface tension of the material to be welded". There are many kinds of fluxes, which can generally be divided into inorganic series, organic series and resin series. Inorg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 余洪桂邓勇贾静宁刘婷罗建
Owner 上海一远电子科技有限公司
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