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Epoxy resin curing agent, method for preparing same and application thereof

An epoxy resin curing and epoxy resin technology, which is applied in the field of epoxy resin curing agent and its preparation, can solve the problems of poor weather resistance, easy pulverization, brittleness, fatigue resistance, heat resistance, and poor impact toughness. , to achieve the effect of improving adhesion and flexibility, good low-temperature curing performance, and simple preparation process

Inactive Publication Date: 2010-04-21
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, epoxy resin also has shortcomings: the cured epoxy resin has high crosslinking density and large internal stress, so it is brittle, has poor fatigue resistance, heat resistance, and impact toughness, and is difficult to meet the needs of engineering technology; poor weather resistance , easy to pulverize; the resistance to strong corrosive media (such as strong acids, alkalis and solvents) needs to be improved
[0005] The siloxane-modified epoxy resin synthesized by the above method is only improved in terms of toughness, heat resistance and water absorption, but has no improvement in the weather resistance of the resin and the resistance to strong corrosive media. It is difficult to meet the relevant technical requirements

Method used

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  • Epoxy resin curing agent, method for preparing same and application thereof
  • Epoxy resin curing agent, method for preparing same and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Take 1.0 mole of γ-aminopropylmethyldimethoxysilane and dilute it with 1.0 mole of ethanol to obtain an ethanol solution of alkoxysilane;

[0047] At 0°C, add 1.0 mole of water dropwise to the ethanol solution of alkoxysilane, stir for 2 hours, keep the temperature for 16 hours, remove the solvent, and obtain oligosiloxane;

[0048] At 45°C, add 10.0g of cardanol dropwise to 50.0g of oligosiloxane, and stir at a constant temperature for 16 hours; then add 3.0g of hydroxyethylethylenediamine dropwise, and stir at a constant temperature for 10 hours to obtain a new epoxy resin Resin curing agent.

[0049] Mix 30.0g of epoxy resin with 15.0g of titanium dioxide, 5.0g of talc, and 8.0g of barium sulfate; then add 14.0g of oligosilicon epoxy resin curing agent and mix evenly to obtain coating 1, which is evenly coated on the substrate. Under room temperature, after standing for seven days, the performance test of the paint film was carried out.

Embodiment 2

[0051] Take 0.5 moles of γ-aminopropylmethyldimethoxysilane and 0.5 moles of 3-aminopropyltriethoxysilane and dilute with 3.0 moles of ethanol to obtain an ethanol solution of alkoxysilane;

[0052] At 60°C, add 0.7 mol of water dropwise to the ethanol solution of alkoxysilane, stir for 1 hour, keep the temperature for 8 hours, remove the solvent, and obtain oligosiloxane;

[0053] At 75°C, add 5.0g of cardanol and 5.0g of 2,6-di-tert-butylphenol to 50.0g of oligosiloxane, and stir at constant temperature for 2 hours; then dropwise add 2.0g of triethylenetetramine and 1.2g of bis(4-amino-3-methylcyclohexyl)methane was stirred at constant temperature for 2 hours to prepare a novel epoxy resin curing agent.

[0054] Mix 32.0g of epoxy resin with 5.0g of talcum powder, 12.0g of mica iron oxide, and 10.0g of barium sulfate; then add 16.0g of oligosilicon epoxy resin curing agent and mix evenly to obtain coating 2, and evenly coat the substrate superior. Under room temperature, a...

Embodiment 3

[0056] Take 0.5 mole of 3-aminopropyltriethoxysilane and 0.5 mole of N-aminoethyl-3-aminopropylmethyldimethoxysilane and dilute with 4 moles of ethanol to obtain an ethanol solution of alkoxysilane;

[0057] At 20°C, add 0.9 moles of water dropwise to the ethanol solution of alkoxysilane, stir for 0.5 hours, keep the temperature for 12 hours, remove the solvent, and obtain oligosiloxane;

[0058] At 85°C, 5.8g of 2,6-di-tert-butylphenol and 6.4g of nonylphenol were added to 55.0g of oligosiloxane, stirred at constant temperature for 1.5 hours; then 3.0g of dicyandiamide was added dropwise, Stir at constant temperature for 1 hour to prepare a novel epoxy resin curing agent.

[0059] Mix 25.0g of epoxy resin with 12.0g of iron red, 6.0g of talcum powder, and 7.0g of mica powder; then add 15.0g of oligosilicon epoxy resin curing agent and mix evenly to obtain coating three, which is evenly coated on the substrate . Under room temperature, after standing for seven days, the perf...

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Abstract

The invention belongs to the technical field of epoxy resin materials, and in particular relates to an epoxy resin curing agent, a method for preparing the same and application thereof. The preparation method is characterized by: adding water into ethanol solution of organic alkoxy silane monomers, and preparing oligosiloxane through hydrolytic condensation; performing chemical grafting reaction on the oligosiloxane and alkylphenol (the carbon number n of the alkyl group is 1 to 30), and adding polybasic amine for chemical reaction or physical mixing to prepare the novel epoxy resin curing agent. In the method, the curing agent is prepared by adding the alkylphenol and the oligosiloxane, the synthetic process is simple, the reaction conditions are mild, the compatibility between the curing agent and the epoxy resin is good, and the impact resistance, the weathering resistance, the strong acid-alkali resistance, the salt-fog resistance and the like of the epoxy system are improved. Thecuring agent can be applied in various fields of heavy corrosion resistant coatings, epoxy coatings, epoxy adhesives, epoxy composite materials, epoxy electrical packaging materials and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin materials, and in particular relates to an epoxy resin curing agent and its preparation method and application. Background technique [0002] Epoxy resin has good comprehensive mechanical properties, high adhesion, small shrinkage, good stability, and excellent electrical insulation properties. It has been widely used in the manufacture of coatings, adhesives, composite materials, and electronic packaging materials. It plays an important role and has become an indispensable basic material in various industrial fields. [0003] However, epoxy resin also has shortcomings: the cured epoxy resin has high crosslinking density and large internal stress, so it is brittle, has poor fatigue resistance, heat resistance, and impact toughness, and is difficult to meet the needs of engineering technology; poor weather resistance , easy to pulverize; the resistance to strong corrosive media (such as stron...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G77/38C08G77/388C08L63/00
Inventor 顾广新陈玲游波武利民张斌宋时森
Owner FUDAN UNIV
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