Silicon wafer stage double-stage exchange system by adopting air-floatation planar motor

Abstract

The invention relates to a silicon wafer stage double-stage exchange system by adopting an air-floatation planar motor, mainly applied to a photoetching machine system. The silicon wafer stage double-stage exchange system comprises a drill base as well as a silicon wafer stage and a silicon wafer stage driving device having the same structure and respectively working on a preprocessing station and an exposure station. The silicon wafer stage driving device consists of a planar motor and an air-floatation structure, wherein the planar motor adopts a permanent magnetic planar motor, a stepping planar motor, an induction-type planar motor or a switch reluctance planar motor, and consists of a stator and two rotors, wherein the stator is arranged on the top of the drill base, and the rotors are arranged at the bottom of the silicon wafer stage; and the air-floatation structure is formed by a plurality of air-floatation bearings arranged at the bottom of the silicon wafer stage. The system realizes double-stage exchange and stepping scanning motion on the plane by directly driving the silicon wafer stage with the planar motor, thereby improving the productivity, alignment precision and resolution of the photoetching machine.

Description

technical field [0001] The invention relates to a double-swap exchange system for silicon wafer tables of a lithography machine. The system is mainly used in semiconductor lithography machines and belongs to the field of semiconductor manufacturing equipment. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the key system of the lithography machine, the motion accuracy and work efficiency of the silicon wafer ultra-precision motion positioning system (hereinafter referred to as the wafer stage) largely determ...

AI Technical Summary

Problems solved by technology

However, there are also some problems in the double-swap exchange system of the silicon wafer stage. First, the system requires extremely high precision for the docking of the guide rails; Large, which is undoubtedly very important for semiconductor chip factories with high space utilization requirements

The third is that the system needs to use a bridge device with a drive device when exchanging silicon wafers, which increases the complexity of the system

When this stacked drive structure realizes planar motion, both the upper layer linear motor and the silicon wafer stage directly driven by it need to be driven by the bottom layer linear motor, which greatly increases the burden on the bottom layer linear motor, and at the same time brings non-centroid drive, requiring high Problems such as precision synchronous control, the system structure is also very complicated, which limits the movement positioning accuracy of the silicon wafer stage and hinders the improvement of its positioning response speed

The applicant's invention patent in 2007, "Maglev six-degree-of-freedom workbench with large-scale planar motion with moving coil" (patent application number: 200710304519.9) is similar to the technology of the patent of the present invention, but there is a dynamic problem caused by asymmetrical coil layout. The sub-force is asymmetrical, electromagnetic force is required to provide suspension support, large heat generation, complex control and other shortcomings

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