Tin slag reducer

Abstract

The invention discloses a tin slag reducer. The reducer comprises fatty alcohol polyethenoxy ether phosphate, alkoxy alcohol, silicone oil, ammonium dihydrogen phosphate, diethylene glycol monobutyl ether, cyclohexylamine carbonate, phytic acid, ammonium succinate and phosphorus pentoxide. The tin slag reducer can reduce and reuse the tin slag produced in the electronic processing industry, and improves the welding quality and the product quality.

Description

technical field [0001] The invention relates to a tin slag reducing agent. Background technique [0002] In the electronic manufacturing process, the wave soldering process is essential and plays a key role in the soldering quality of electronic products. The characteristics of the wave soldering process determine that the surface of new liquid solder is continuously exposed to the air during the soldering process, and the molten solder contacts with oxygen in the air in a flowing state and continuously oxidizes to form oxide slag. Solder oxide slag is mainly a mixture of alloy solder oxide and a large amount of alloy solder. It is continuously produced and accumulated on the surface of molten alloy solder, which not only affects the fluidity of liquid solder, but also may pollute the PCBA board surface and directly affect the product. Excellent welding quality and reliability, and cause a huge waste of alloy solder. In the electronics manufacturing industry, with the grad...

AI Technical Summary

Problems solved by technology

Solder oxide slag is mainly a mixture of alloy solder oxide and a large amount of alloy solder. It is continuously produced and accumulated on the surface of molten alloy solder, which not only affects the fluidity of liquid solder, but also may pollute the PCBA board surface and directly affect the product. Excellent welding quality and reliability, and cause a huge waste of alloy solder

In the electronics manufacturing industry, with the gradual introduction of lead-free soldering technology, lead-free solder alloys with high tin content gradually replace traditional Sn63 / 37 alloy solders; the content of Sn in lead-free solders is much higher than that of traditional leaded solders , so it is easier to oxidize and produce more oxide slag (SnO2); with the wide application of lead-free solder, the problem of oxide slag becomes more serious, and the waste rate is as high as 30%-50%; the soldering quality and reliability of the product Performance is also considerably affected; how to reduce tin oxide dross becomes a problem that needs to be solved in the electronics manufacturing industry

[0003] The traditional tin slag reducing agent is used once a day, which saves trouble, but it is oily, difficult to clean the tin bath, smoky, causing environmental pollution, and the slag tends to sink to the bottom of the furnace tank, resulting in waste and low reduction rate

Traditional tin slag reducing agents are generally not in line with environmental protection, causing environmental pollution, corroding equipment, and endangering the health of employees and the risk of cancer