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Circuit board and method for manufacturing the same

A technology of circuit substrate and manufacturing method, applied in printed circuit manufacturing, printed circuit, printed circuit and other directions, can solve problems such as difficulty in forming wiring, increase in processing steps, miniaturization of wiring, difficulty in high density, etc.

Inactive Publication Date: 2009-11-11
TOYOTA JIDOSHA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the required wiring film thickness is as thin as 10 μm or less, it can be expected that a fine circuit pattern can be formed, but when a thick wiring film is required, the width of the concave portion must also increase. As a result, the miniaturization of the wiring and the high density becomes difficult
In addition, it is difficult to form wiring with an aspect ratio of 1 or more, which is also a factor hindering the miniaturization of wiring.
In addition, since the chemical solution is applied to the polyimide film one by one, the number of processing steps increases and the cost inevitably increases.

Method used

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  • Circuit board and method for manufacturing the same
  • Circuit board and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0027] figure 1 The first embodiment of the method for manufacturing a circuit board of the present invention is shown in order of steps. exist figure 1 Among them, 10 is a casting mold, and a convex portion corresponding to a circuit pattern formed on the surface of the circuit board to be obtained is formed on the flat surface side of a nickel alloy plate having at least one flat surface by a conventionally known electroforming process. 11. like figure 1 As shown in a, two types of convex portions 11 a and convex portions 11 b having different heights are formed on the mold 10 . The convex part 11b1 which is one of the convex parts 11b is wider than the other convex part.

[0028] The width of the protrusions 11a and 11b is 5 μm, the width of the protrusion 11b1 is 20 μm, the distance between the protrusions is 5 μm, the height of the protrusion 11a is 15 μm, and the height of the protrusion 11b is 5 μm.

[0029] Next, if figure 1 As shown in b, on the front end of the...

Embodiment approach 2

[0035] figure 2 The second embodiment of the method for manufacturing a circuit board of the present invention is shown in order of steps. Here, as the material of the casting mold 10, a glass plate with a flat surface is used, and by performing a conventionally known sandblasting treatment, such as figure 2 As shown in a, the convex portion 11 is formed on the flat surface side of the glass plate. The protrusions 11 have a width of 5 μm and a height of 10 μm, and one protrusion 11 c has a width of 10 μm. In addition, the distance between the protrusions was 5 μm.

[0036] Next, a silver paste mainly composed of silver nanoparticles with an average particle diameter of 20 nm is stretch-coated on the PET plate with a thickness of 2 μm by using a bar coater or the like, and the convex portion 11 side of the mold 10 is pressed against it. ,like figure 2 As shown in b, the casting mold 10 in which the silver paste 13 was applied to the tip of the convex portion 11 was obtai...

Embodiment approach 3

[0041] Although not shown, as the material of the mold 10 , a quartz plate with one surface flat was used, and similar to Embodiment 2, convex portions with a width of 50 μm and a height of 50 μm were formed. The distance between the protrusions was 10 μm.

[0042] Next, the silver paste mainly composed of silver nano-ions with an average particle diameter of 5 nm is coated with a thickness of 5 μm by using a bar coater or the like on the PET plate, and the convex portion 11 side of the mold 10 is pressed against it. Thus, the mold 10 in which the silver paste was applied to the tip of the convex portion 11 was obtained.

[0043] A polycarbonate resin film having a thickness of 80 μm was placed on a glass plate, the convex portion 11 side of the mold 10 was pressed thereon, and heat treatment was performed at 170° C. for 10 minutes under vacuum.

[0044] When the mold 10 is removed after normal temperature and pressure, the resin molded article 30 in which the shape of the co...

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Abstract

A circuit board which can be manufactured by a simpler process and has a minute circuit pattern. A mold (10) having protrusions (11) corresponding to a circuit pattern on the surface is employed, and a conductive material layer (metal paste) (13) is applied to the distal end of the protrusions (11) of the mold (10). It is then hot pressure welded to the surface of a substrate (20), for example, resin film. The conductive material layer (metal paste) (13) is transferred to the substrate (20) together with the profile of the protrusions (11). A resin substrate (resin molding (30)) subjected to transfer is immersed in copper sulfate plating bath, for example, and electrolytic plating is performed. Copper ions in the plating bath are deposited in recesses (31) which are transferred using the transferred conductive material layer (13) as a base material, thus forming a metal wiring (32). The recess (31) being transferred to the substrate (20) side depends on the profile of the protrusions (11) of the mold (10), and thereby a high density minute circuit pattern composed of a metal wiring (32) having an arbitrary aspect ratio can be formed.

Description

technical field [0001] The present invention relates to a circuit board and a manufacturing method thereof, and more particularly to a circuit board in which metal wiring is formed along a desired pattern on the surface of a film-like substrate made of a resin material or the like, and to a manufacturing method thereof. Background technique [0002] Dry processes such as a vacuum deposition method and a sputtering method are known as methods for forming a fine circuit pattern on the surface of a film-like resin substrate. In addition, for example, the entire surface of the substrate made of polyimide resin is covered with a metal film such as copper foil to form a metal coating material, and etching treatment is performed by photolithography to remove unnecessary parts of the metal film. The subtractive method is also widely used. However, it is difficult to form fine wiring with a width of about 30 μm or less by the removal method, and further technological innovation is b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/20H05K3/10H05K3/18
CPCH05K2201/09736H05K2203/0108H05K3/207H05K3/246H05K2201/0347H05K3/107H05K3/20Y10T29/49156Y10T29/49155Y10T29/49158Y10T29/49117B29C59/02
Inventor 柳本博别所毅绳舟秀美赤松谦祐
Owner TOYOTA JIDOSHA KK
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