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Metal surface treatment agent and printed wiring board with protecting film formed thereby

A technology for metal surface treatment and function, applied in the application of non-metallic protective layer, metal material coating process, secondary treatment of printed circuit, etc. question

Inactive Publication Date: 2011-03-30
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a novel metal surface treatment agent (OSP), which overcomes the traditional oxidant that cannot be complexed with metal ions (such as copper ions), imidazole compounds, and cannot be deposited on the organometallic polymer film (OSP) together. Therefore, it is impossible to enhance the anti-oxidation performance of the exposed copper surface in the subsequent PCB soldering process, so that a certain proportion of anti-oxidation substances (non-entrainment) are embedded in the formed organometallic polymer film, so that there is no need for existing Modification of the structure of some imidazole or benzimidazole derivatives can improve the heat resistance temperature and heat resistance of the corresponding OSP film, reaching the standard required in the subsequent PCB welding process

Method used

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  • Metal surface treatment agent and printed wiring board with protecting film formed thereby
  • Metal surface treatment agent and printed wiring board with protecting film formed thereby
  • Metal surface treatment agent and printed wiring board with protecting film formed thereby

Examples

Experimental program
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Effect test

Embodiment 1

[0043] The components and the content of each component of the OSP aqueous solution treatment agent of embodiment 1 are shown in Table 1.

[0044] In Example 1, the composition described in Table 1 was dissolved in deionized water, and the pH was adjusted to 3.0 with ammonia water, thereby preparing a metal surface treatment agent. Then, degrease the test piece of the printed circuit board (as a circuit diagram, formed by 10 copper foils of 40×0.7mm, each copper foil is 1mm apart in the width direction), wash with water, and do it in sulfuric acid / hydrogen peroxide. Soak in the microetching agent for 60-120 seconds, wash 3 times with deionized water, dry, soak in 3-5% hydrochloric acid aqueous solution for 15-30 seconds, wash 3 times with deionized water, dry, and place in a surface treatment agent at 40°C Soak for 60 seconds, dry, wash with deionized water 3 times, and dry to form a 0.1-0.5 micron protective film on the surface of the circuit board.

Embodiment 2-10

[0046] A metal surface treatment agent having a composition described in Table 1 was prepared in the same manner as in Example 1. The printed circuit board was treated with the same process as in Example 1, and then the protective film on the PCB was prepared under the conditions recorded in Table 1.

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Abstract

The invention relates to a metal surface treatment agent which is used for protecting the surface of metal from being oxidized, improving the solderability of the metal and providing a protective coating for the copper surface of a printed circuit board (PCB), and a printed wiring board with a protecting film formed by applying the treatment agent. The surface treatment agent contains azole compound, organic acid, cupric compound, zinc compound, iron compound and aqueous solution of the compounds having antioxidant effect; wherein, the compounds having antioxidant effect are calixarenes compound and thiacalixarenes compound which have the structure in formula (1), and can be sedimentated on the surface of the metal together with imidazole and metallic ions to form the protecting film. In the formula (1), R1 is SO3<->, COO<->or tert-butyl group, and R2 is S, SO or SO2. n=4, 6.

Description

technical field [0001] The present invention relates to a treatment agent for metal surfaces, in particular to a metal surface for protecting the metal surface from oxidation and enhancing its solderability, providing a protective coating for the copper surface of a printed circuit board (PCB) treatment agent. The present invention also relates to a printed wiring board to which the treating agent is applied to form a protective film. Background technique [0002] In recent years, high-density surface mount technology has been widely used. This process requires multiple soldering of the PCB, which makes the PCB withstand multiple high temperatures, which accelerates the formation of an oxide film on the surface of part of the copper or copper alloy in the PCB, so it cannot be maintained. Good solderability of the surface. In order to protect the copper circuit part of the PCB from being oxidized by air, a surface treatment agent is usually used to form a protective chemica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C22/05H05K3/28
Inventor 黄艳陈群郭丹卢志云谢明贵
Owner SICHUAN UNIV
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