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Bonder and method of preparing the same

A technology of bonding glue and epoxy resin, applied in the direction of chemical instruments and methods, adhesives, epoxy resin glue, etc., to achieve the effect of accelerating the curing process, convenient operation, and strong protection

Active Publication Date: 2012-08-15
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bonding adhesives currently on the market have many shortcomings, such as: harsh storage conditions, long curing time, poor thermal stability, poor bonding ability with circuit boards, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (2) take bisphenol A type epoxy resin (its viscosity is 10000cps, epoxy equivalent is 180) 100Kg (kilogram), C 10 -C 15 Alkyl glycidyl ether 0.2Kg, imidazole compound of triazine group 5Kg, 2-methylimidazole 4Kg, nano-scale fumed silica 1.8Kg, non-conductive nano-scale carbon powder 0.5Kg, organosilane defoamer 0.5 Kg;

[0029] (3) Bisphenol A type epoxy resin, C10-C15 alkyl glycidyl ether, imidazole compound of triazine group, 2-methylimidazole, nano-scale fumed silica, non-conductive nano-scale carbon powder , organic silane defoamer and other materials are added to a clean, dry reaction vessel with a cooling water jacket; then run the cooling water jacket to control the temperature of the material in the reaction vessel at 20-50°C, and The materials are stirred (the stirring speed is 1800rpm, and the stirring time is 20min), so that each material is rapidly dispersed to obtain a rubber compound;

[0030] (4) Use a three-roll grinder to grind the sizing material ob...

Embodiment 2

[0038] (2) take bisphenol A type epoxy resin (its viscosity is 20000cps, epoxy equivalent is 190) 100Kg, C 10 -C 15 Alkyl glycidyl ether 2Kg, imidazole compound of triazine group 8Kg, 2-phenylimidazole 2Kg, 2-heptadecyl imidazole 3Kg, nano-scale fumed silica 0.5Kg, non-conductive nano-scale carbon powder 0.7 Kg, organosilane defoamer 0.12Kg, dispersant 0.06Kg (all are monoglyceride stearate);

[0039] (3) Bisphenol A type epoxy resin, C10-C15 alkyl glycidyl ether, imidazole compound of triazine group, 2-phenylimidazole, 2-heptadecyl imidazole, nanoscale fumed silica , non-conductive nano-scale carbon powder, organosilane defoamer, dispersant and other materials are added to a clean, dry reaction vessel with a cooling water jacket; then run the cooling water jacket to control the temperature of the materials in the reaction vessel at 20-50°C, and stir the materials in the reaction vessel (the stirring speed is 3000rpm, and the stirring time is 15min), so that the materials ar...

Embodiment 3

[0049] (2) Weigh 100Kg of bisphenol A type epoxy resin (viscosity is 15000cps, epoxy equivalent is 200), C10-C15 alkyl glycidyl ether 1.2Kg, imidazole compound 6Kg of triazine group, 2-phenyl -4-methylimidazole 3Kg, nano-scale fumed silica 1Kg, non-conductive nano-scale carbon powder 0.9Kg, organosilane defoamer 0.3Kg, dispersant 0.5Kg (all are glyceryl tristearate);

[0050] (3) Bisphenol A type epoxy resin, C10-C15 alkyl glycidyl ether, imidazole compound of triazine group, 2-phenylimidazole, 2-heptadecyl imidazole, nanoscale fumed silica , non-conductive nano-scale carbon powder, organosilane defoamer, dispersant and other materials are added to a clean, dry reaction vessel with a cooling water jacket; then run the cooling water jacket to control the temperature of the materials in the reaction vessel at 20-50°C, and stir the materials in the reaction vessel (the stirring speed is 2000rpm, and the stirring time is 25min), so that the materials are rapidly dispersed to obtai...

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PUM

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Abstract

A bonding glue is characterized by containing the components proportioning by weight: 100 parts of bisphenol A type epoxide resin, 0.1-2 parts of alkyl glycidyl ether, 5-8 parts of triazine group imidazolium compound, 3-5 parts of imidazoles accelerant, 0.5-2 parts of gas phase silicon dioxide, 0.5-1 part of carbon powder, 20-40 parts of calcium carbonate, 40-80 parts of aluminium hydroxide and 0.1-0.5 part of organosilane defoaming agent. The bonding glue can be solidified under the condition of 120-150 DEG C and stored for a longer time; generally, the bonding glue can be stored for one month at normal temperature and stored for half a year in a freezer at the temperature below 5 DEG C; furthermore, as the triazine group imidazolium compound is matched with the imidazoles accelerant foruse, curing process can be accelerated, and the products have higher thermal stability after being solidified. When in use, the bonding glue has moderate fluidity and is convenient for operation; furthermore, the solidified bonding glue has stronger hardness and thixotropy.

Description

technical field [0001] The invention relates to packaging materials for semiconductor electronic products, in particular to a bonding adhesive used for packaging semiconductor electronic products and a preparation method for the bonding adhesive. Background technique [0002] Existing bonding adhesives generally consist of epoxy resins, curing agents, accelerators, fillers and various additives, and can be used for encapsulation of semiconductor electronic products (such as circuit boards of electronic watches and circuit boards of calculators). However, the bonding adhesives currently on the market have many shortcomings, such as: harsh storage conditions, long curing time, poor thermal stability, poor bonding ability with circuit boards, and so on. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a bonding adhesive with long storage period, fast curing speed, strong thermal stability and moderate fluidity, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09K3/10H01L23/29
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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