Ultra-precision processing apparatus based on photon crystal material and imaging monitoring method

Abstract

The invention discloses a superprecision machining device based on a photon crystal material and a method for monitoring imaging and relates to the mechanical manufacturing industry technical field, in particular to the technical field of the superprecision machining device based on the photon crystal material. The lower end of a polishing sheet supporting frame power system is connected with a supporting clamp; the lower end of the supporting clamp is connected with the polishing sheet; the lower end of the polishing sheet is correspondingly provided with a substrate; a polished and fallen grinding medium is filled between the polishing sheet and the substrate; detecting light emitted by a detecting light source is reflected on a spectrum scanning platform by a phase dichroscope and transported to a scanning lens arranged on the upper end of the spectrum scanning platform; and the detecting light runs through the scanning lens and reaches a substrate supporting frame. The superprecision machining device and the method realize the aims of having good polishing effect, monitoring the spectral characteristic of the polishing sheet in a polishing region at any moment and acquiring the local deformation and the stress parameters of the polishing sheet in time.

Description

technical field [0001] The invention relates to the technical field of machinery manufacturing, in particular to the technical field of ultra-precision processing devices based on photonic crystal materials. Background technique [0002] With the vigorous development of society, people's demand for large-area semiconductor silicon wafers and optical materials used in high-end electronic and optical detection industries is increasing. With the current 12-inch silicon wafers being put into production, for larger-area silicon wafers Research on the manufacturing process has never stopped. In the field of electronic manufacturing, the drive to develop equipment for the microfabrication of large-area silicon wafers has never stopped. For example, the development of large-area STEP exposure equipment, large-diameter silicon ingot growth equipment, and large-diameter silicon wafer cutting, grinding, and polishing equipment have always been the research targets of advanced manufact...

AI Technical Summary

Problems solved by technology

Due to the contact between the polishing area and the processing abrasive, the introduction of the online roughness measurement device is more complicated, and the polishing process has an impact on the roughness measurement

In addition, the background noise and duration of fluorescence bring certain problems to the monitoring of the polishing area.

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