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Conductive paste, lamination ceramics electronic assembly and method for manufacturing the electronic assembly

A technology of conductive paste and electronic components, applied in the direction of laminated capacitors, conductive materials dispersed in non-conductive inorganic materials, components of fixed capacitors, etc., can solve problems such as sheet erosion, and prevent sheet erosion. , Improve the effect of preventing and reducing short circuit defects

Inactive Publication Date: 2008-04-02
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, although this solvent with good anti-sheet erosion effect can prevent sheet erosion at room temperature, when the temperature rises to the drying temperature of the solvent (for example, 40-90°C), sheet erosion will also occur. Therefore, Sheet erosion sometimes occurs when solvent dries

Method used

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  • Conductive paste, lamination ceramics electronic assembly and method for manufacturing the electronic assembly
  • Conductive paste, lamination ceramics electronic assembly and method for manufacturing the electronic assembly
  • Conductive paste, lamination ceramics electronic assembly and method for manufacturing the electronic assembly

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Embodiment approach

[0099] The embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, and various changes can be made without departing from the scope of the present invention.

[0100] For example, the above embodiment exemplified a multilayer ceramic capacitor as the multilayer ceramic electronic component of the present invention. The multilayer ceramic electronic component of the present invention is not limited to a multilayer ceramic capacitor, and of course, a multilayer ceramic substrate or the like may be used.

Embodiment 1

[0104] First, a butyral resin-containing dielectric paste for forming a ceramic green sheet using a butyral resin (polyvinyl butyral) as an organic binder is prepared.

[0105] Preparation of dielectric paste containing butyral resin

[0106] Prepare BaTiO 3 Ceramic powder, polyvinyl butyral (PVB) as an organic binder, and methanol as a solvent. Then, 10 parts by weight of the organic binder and 150 parts by weight of the solvent were weighed out with respect to 100 parts by weight of the ceramic powder, and kneaded and slurried with a ball mill to obtain a butyral resin-containing dielectric paste.

[0107] Production of ceramic green sheets containing butyral resin

[0108] The above-mentioned dielectric paste was coated on a PET film with a predetermined thickness by a knife coating method, and dried to form a butyral resin-containing ceramic green sheet with a thickness of 1.5 μm after drying.

[0109] Compatibility test between solvent and ceramic green sheet containing ...

Embodiment 2

[0117] Compatibility test between solvent and acrylic resin-containing ceramic green sheet (50°C, immersion)

[0118] Except that an acrylic resin was used as the organic binder, the same operation as in Example 1 was carried out to produce an acrylic resin-containing dielectric paste and an acrylic resin-containing ceramic green sheet. The same operation was carried out as in Example 1, and the solvent and acrylic Compatibility test of resin-like ceramic green sheets (50°C, immersion).

[0119] In addition, in Example 2, the various solvents shown in Table 2 below were used as the solvent, and the photographs of the acrylic resin-containing ceramic green sheets immersed in each solvent are shown in the respective figures in Table 2. .

[0120] Table 2

[0121] Solvent

[0122]From Figure 4(B) to Figure 4(D), it can be confirmed that when isobornyl propionate and tridecane are used in combination as a solvent, even when the acrylic resin-containing ceramic green sheet ...

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Abstract

The invention provides conductive paste for forming the inner electrode of the laminated ceramic electronic parts, which is characterized in that the conductive paste includes conductive power and organic carrier. An organic adhesion agent in the organic carrier has the ethyl cellulose resin and / or the alkide resin as the main components. The solvent in the organic carrier comprises one or more components selected from propionic acid isoborneol ester, butyrate isoborneol ester and isobutyric acid isoborneol ester and the aliphatic hydrocarbon with the carbon atoms of 5-40. The conductive paste may effectively prevent the sheet material from corrading even under the solvent drying temperature of 40-90 DEG C when the ceramic crude sheet is thinner.

Description

Technical field [0001] The present invention relates to a conductive paste for forming internal electrodes of a laminated ceramic electronic component, a laminated ceramic electronic component manufactured using the paste, and a method of manufacturing the electronic component. Background technique [0002] In recent years, the lighter, thinner, shorter and smaller electronic components have been developed. Along with this development, the multilayer ceramic electronic components used in the electronic components are also undergoing further miniaturization and higher capacity. [0003] In order to miniaturize and increase the capacitance of a multilayer ceramic capacitor as an example of a multilayer ceramic electronic component, the most effective method is to make both the internal electrode and the dielectric layer as thin as possible (thinning) and reduce They are stacked as much as possible (multilayered). [0004] The manufacturing method of a multilayer ceramic capacitor i...

Claims

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Application Information

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IPC IPC(8): H01B1/20H01B1/22H01B1/16H01G4/008H01G4/30H01F17/00
CPCH01B1/22H01G4/008H01G4/12H01G4/30
Inventor 三浦秀一小田和彦丸野哲司
Owner TDK CORPARATION
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