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Atomizing activating process for electroless plating on water-absorbing substrate surface

A water-absorbing, electroless plating technology, applied in the field of electroless plating, can solve the problems of a large amount of waste liquid, easy pollution of activation liquid, cumbersome operation, etc., and achieve the effects of stable activation liquid, saving activation liquid, and less consumption

Inactive Publication Date: 2008-03-12
NANJING ZHONGDA QINGSHAN ELECTRIC VEHICLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to solve the problem that the non-metal substrate, especially the water-absorbing non-metal substrate, is cumbersome to operate, the activation solution is easily polluted, and a large amount of waste liquid is produced in the activation process before the electroless plating. Spray Activation Method of Electroless Plating on Substrate Surface

Method used

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  • Atomizing activating process for electroless plating on water-absorbing substrate surface

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Experimental program
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Effect test

Embodiment 1

[0024] (1). Substrate pretreatment: the outer diameter is 1.2cm, the inner diameter is 0.8cm, the length is 10cm, and the water absorption is 460ml / m 2 The porous ceramic tubes were washed with commercially available detergent solution, tap water, and deionized water in sequence, and dried.

[0025] (2). Preparation of activation solution: 0.1gPdCl 2 Add it into 10ml of deionized water, oscillate ultrasonically for 10min, add 40ml of 1M NaOH solution, continue ultrasonically oscillating for 2 hours, and finally obtain a brown-black colloid, in which the palladium content is about 0.01mol / L.

[0026] (3). Activation of the substrate: Spray the activation solution on the outer surface of the ceramic tube with a nitrogen gas flow atomizer (gas pressure 0.2Mpa, nozzle aperture 0.5mm), and rotate the ceramic tube at the same time until the surface presents a uniform brown Yellow (as shown in Figure 1). After drying in the air, place it in a hydrazine solution with a concentration...

Embodiment 2

[0029] (1). The pretreatment of the matrix and the preparation of the activation solution are the same as the steps (1) and (2) of Example 1.

[0030](2). Activation of the substrate: Spray the activation liquid on the outer surface of the ceramic tube with an air flow atomizer (gas pressure 0.4Mpa, nozzle aperture 0.8mm), dry it and place it at 40°C with a concentration of 0.1M hydrazine solution for 5 minutes.

[0031] (3). Electroless silver plating. The composition of the silver plating solution is: 5g / L AgNO 3 , 500ml / L concentrated ammonia water, 35g / L disodium edetate, the coating temperature is 30℃, the reducing agent is 0.5M N 2 h 4 . The prepared silver film is shown in Figure 4.

Embodiment 3

[0033] (1). The pretreatment of the matrix, the preparation of the activation solution and the activation of the matrix are the same as the steps (1) and (2) of Example 1.

[0034] (2). Activation of the substrate: Use an argon gas flow atomizer (gas pressure 0.2Mpa, nozzle aperture 0.5mm) to evenly spray palladium hydroxide colloid on the surface of the substrate, and dry it at 200°C under a hydrogen atmosphere Restore for 5 minutes.

[0035] (3). Electroless nickel plating. The composition of the nickel plating solution is: 30g / L NiSO 4 ·6H 2 O, 250ml / L concentrated ammonia water, the coating temperature is 60°C, and the reducing agent is 0.5M N 2 h 4 . The prepared nickel film is shown in Figure 5.

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Abstract

The invention relates to an activating process before chemical plating any hydroscopic substrate. Some activating solution containing palladium salt is evenly sprayed on a pretreated substrate surface by high-pressure atomizing or air-flow atomizing method, then metallic palladium particles are obtained by reduction treatment and used as a catalyst to activate the substrate surface. The palladium salt deposited on the substrate surface can be reduced into metallic palladium particles by hydrogen or diamine solution and used as a reaction catalyst for chemical plating. The invention is easy to operate, of low cost, and almost generates no waste liquid during operation; the activating liquid is steady and can be kept for a long term; nanometer metallic palladium particles will generate after activation, and the catalysis activity is high.

Description

technical field [0001] The invention relates to an activation technology before electroless plating on the surface of a non-metal substrate, especially a water-absorbing substrate, which is used for electroless plating to obtain a uniform metal plating layer. Background technique [0002] Electroless plating is a common technique for preparing a thin metal layer on the surface of a base material, especially a non-conductive base material. Instead of using an electric current, it uses a reducing agent to reduce the metal ions in the solution to form a metal coating. Its biggest feature is that there is a coating of similar thickness where the substrate touches the plating solution, and the coating has a good appearance, compactness and corrosion resistance. Common electroless plating metal layers include nickel, copper, silver, gold, platinum, cobalt, nickel-boron alloy, nickel-phosphorus alloy, etc. The advantages of electroless plating are: simple process, low cost, less i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30B05D7/24B01J23/44
Inventor 黄彦范菁菁俞健胡小娟
Owner NANJING ZHONGDA QINGSHAN ELECTRIC VEHICLE
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