Epoxy binder modified by micropowder of crosslinked rubber, and preparation method

A technology of epoxy adhesive and cross-linked rubber, applied in the direction of adhesive, epoxy resin, adhesive type, etc. Chemical properties and other issues, to achieve the effect of improving adhesive strength and heat resistance, small particle size, and enhancing adhesion

Inactive Publication Date: 2007-10-10
HUNAN SHENLI IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the phase separation of this modified system to form a two-phase structure, the type of curing agent used and the curing conditions are very different, often due to incomplete phase separation, the rubber continues to dissolve in the continuous phase of epoxy resin In this process, the inherent glass transition temperature (heat resistance) and modulus of the epoxy resin will decrease, and it is difficult to improve the brittleness of the resin, improve the impact resistance and maintain the original heat resistance, mechanical strength and chemical resistance of the epoxy resin. sexual purpose

Method used

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  • Epoxy binder modified by micropowder of crosslinked rubber, and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A: Preparation of epoxy components

[0023] Heat 60 parts of bisphenol A epoxy resin E-51 and 40 parts of E-44 to 60-80°C, after it becomes thin, turn on the high-speed disperser, adjust the speed to 6000 rpm, and slowly add nano-crosslinking Rubber powder VP-50115 parts, stirred for 60 minutes, put the material in a vacuum kneader, and added diluent C 12 ~C 13 5 parts of aliphatic glycidyl ether, the temperature is controlled at 40°C, the vacuum degree is 0.08-0.09MPa, and the kneading time is 2.5 hours to discharge.

[0024] B: Preparation of curing components

[0025] Add 40 parts of modified alicyclic amine and 13 parts of modified aromatic amine into the reaction kettle. After stirring for 15 minutes, add 2 parts of curing accelerator triethylenediamine, stir evenly, and then add silicone coupling agent r-aminopropyl 1 part of triethoxysilane, stirred for 30 minutes, and filtered out.

example 2

[0027] Among the raw material epoxy components used are 50 parts of epoxy resin E-51, 30 parts of E-44, 16 parts of nano-crosslinked rubber micropowder VP-501, and 4 parts of diluent o-cresol glycidyl ether. Among the curing components are 30 parts of modified alicyclic amine, 22 parts of modified fatty amine, 1.8 parts of curing accelerator triethylenediamine, and 1.2 parts of coupling agent r-aminopropyltriethoxysilane.

[0028] Manufacturing process condition is the same as embodiment 1

Embodiment 3

[0030] Among the raw material epoxy components used are 28 parts of epoxy resin E-51, 50 parts of E-44, 12 parts of nano-crosslinked rubber micropowder VP-701, and 6 parts of diluent trimethylolpropane triglycidyl ether. In the curing component, there are 30 parts of modified aromatic amines, 24 parts of modified aliphatic amines, 2.5 parts of curing accelerator 2,4,6-tris(dimethylaminomethyl)phenol, coupling agent N-(β-aminoethyl base)-r-aminopropyltrimethoxysilane 1.7 parts.

[0031] Manufacturing process condition is the same as embodiment 2

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Abstract

This invention relates to a method for preparing epoxy adhesive modified by nano-crosslinked rubber micropowder. The epoxy adhesive is composed of epoxy component and curing component. The epoxy component comprises bisphenol A type epoxy resin, nano-crosslinked rubber micropowder, and diluting agent. The curing component comprises modified amine curing agent, curing promoter, and coupling agent. The epoxy component and the curing component are separately prepared and packaged, and are mixed uniformly when used. The epoxy adhesive has high heat resistance without being influenced by curing agent variety or curing condition, high tensile / shear strength, high peel strength, and high impact resistance.

Description

technical field [0001] The invention relates to a modified epoxy adhesive, in particular to an epoxy adhesive modified by nano-crosslinked rubber micropowder. Background technique [0002] In the 1970s, liquid rubber toughener modified epoxy resin technology emerged. The typical toughener variety is carboxyl-terminated nitrile rubber (CTBN), which toughens and modifies epoxy resin by forming a two-phase structure (that is, sea-island structure ) realized. However, due to the phase separation of this modified system to form a two-phase structure, the type of curing agent used and the curing conditions are very different, often due to incomplete phase separation, the rubber continues to dissolve in the continuous phase of epoxy resin In this process, the inherent glass transition temperature (heat resistance) and modulus of the epoxy resin will decrease, and it is difficult to improve the brittleness of the resin, improve the impact resistance and maintain the original heat r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/06C09J109/00
Inventor 袁宏伟李冬月郑保昌王理尧
Owner HUNAN SHENLI IND
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