Pressure-sensitive adhesive having its adherence lost by actinic energy radiation, adhesive sheet having its adherence lost by actinic energy radiation obtained by application of the pressure-sensitiv

Abstract

A pressure-sensitive adhesive having its adherence lost by actinic energy radiation, comprising an etching-resistant photopolymerization initiator, an actinic energy radiation reactive compound and a hardening agent. Further, there is provided a process for producing an etched metallic material, comprising the steps of: (1) adhering a metal foil to a base film by means of the above pressure-sensitive adhesive having its adherence lost by actinic energy radiation; (2) performing selective etching of the metal foil to thereby obtain an etched metal layer; (3) combining the etched metal layer of the laminate composed of the base film, pressure-sensitive adhesive having its adherence lost by actinic energy radiation and etched metal layer with an insulating substrate; and (4) detaching the base film from the etched metal layer, wherein exposure to actinic energy radiation is carried out at least once after the step (1) but prior to the step (4).

Description

technical field [0001] The present invention relates to an active energy ray adhesive loss type pressure-sensitive adhesive used in the production process of printed circuit boards, semiconductor device storage boxes, metals, plastics, semiconductor wafers, etc. A method for producing an active energy ray-adhesion-disappearing adhesive sheet and an etched metal article of an adhesive. Background technique [0002] In recent years, as the performance of various electronic devices has improved, the density of circuit boards used in printed circuit boards and semiconductor device storage boxes has been increasing, and it is required to set the circuit width and circuit pitch to 20 μm or less. [0003] Therefore, as a method of forming a fine circuit pattern, it has been proposed that a metal foil for forming a circuit pattern is attached to the surface of an adhesive sheet carrying a pressure-sensitive adhesive layer whose adhesive force is reduced by ultraviolet irradiation, a...

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Problems solved by technology

[0008] If the photopolymerization initiator is eluted from the interface between the circuit pattern non-forming part or the circuit pattern forming part and the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer of the circuit pattern forming part whose adhesive force must be lowered when ultraviolet irradiation is performed Adhesion will not decrease, so the pressure-sensitive adhesive remains on the metal surface of the circuit pattern during the peeling operation, causing contamination of the circuit side after peeling

[0009] In addition, when the circuit pattern is transferred to the insulating substrate, although the adhesive sheet is peeled off by irradiating ultraviolet rays, the adhesive force between the insulating substrate and the portion where the circuit pattern is not formed is weakened due to the elution of the photopolymerization initiator. Therefore, the peeling of the adhesive sheet becomes difficult, the yield of the printed circuit board decreases, or the production efficiency and operability are greatly reduced

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