Manufacturing method of etched substrate and light-sensitive resin composition

A technology of photosensitive resin and photosensitive resin layer, which is applied in the field of photosensitive resin composition, and can solve problems such as time-consuming and labor-consuming

Active Publication Date: 2013-01-30
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the process of etching the first Cr layer, while the first Cr layer is etched, the second Cr layer that has been patterned will also be etched, so it is necessary to form a thicker second Cr layer in advance. Time-consuming and labor-intensive process
[0006] In this way, since there is no material that is resistant to both acidic and alkaline etching solutions and is used to form a resin pattern that can be removed with an alkaline stripping solution after the wiring pattern is formed, the current situation is that both acidic and alkaline etching solutions are used. In the pattern formation method of the alkaline etching process, various processes need to be time-consuming and labor-intensive

Method used

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  • Manufacturing method of etched substrate and light-sensitive resin composition
  • Manufacturing method of etched substrate and light-sensitive resin composition
  • Manufacturing method of etched substrate and light-sensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0047] [Preparation of Alkaline Soluble Resin (A)]

[0048] (A) component is prepared by making some acid groups derived from (a1) component react with the epoxy group derived from (a2) component, and introducing an unsaturated group into (a1) component. Specifically, for example, it can prepare by making the inert organic solvent solution of (a1) component, and (a2) component react at about 20-120 degreeC for about 1-5 hours. The inert organic solvent is not particularly limited, and examples thereof include alcohols, esters, and aliphatic or aromatic hydrocarbons. The ratio of the component (a1) to the component (a2) may vary depending on the type of monomer used to synthesize the component (a1), but the ratio of the component (a2) to the component (a1) is preferably 15 mol % or more. Favorable etching resistance can be provided to the resin pattern obtained by hardening the photosensitive resin composition containing (A) component as the ratio of (a2) component with respec...

Embodiment

[0081] The present invention will be described more specifically with reference to the following examples. However, these Examples are only examples of the present invention and cannot limit the scope of the present invention.

[0082]

[0083] According to Table 1-Table 4, the photosensitive resin composition of Examples 1-17 and Comparative Examples 1-3 was prepared. Each component described in Table 1 is as follows. Moreover, the 45 mass % DPGME (dipropylene glycol monomethyl ether) solution of the alkali-soluble resin (A) was prepared and used for preparation of the photosensitive resin composition. However, 100 parts by mass of the alkali-soluble resin (A-1 or A-2) in Tables 1 to 4 means that the solid content of the alkali-soluble resin is 100 parts by mass.

[0084] Alkaline soluble resin (A)

[0085] A-1: Cycloma-ACA Z250 (manufactured by Daicel Chemical Industry Co., Ltd., mass average molecular weight 20000, acid value 101.7mgKOH / g, acrylic resin containing acid...

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PUM

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Abstract

The invention provides a manufacturing method of etched substrate. The etched substrate has etching resistance at acidic and alkaline conditions, and is capable of taking resin pattern stripped by the alkaline stripping liquid as a mask after the etching process is finished. The inventive manufacturing method of etched substrate includes: a process of forming a light-sensitive resin layer on the substrate; a process of performing selective exposal and developing to form resin pattern; a process of taking the resin pattern as a mask, and using acidic or alkaline etching liquid with temperature lower than 45 DEG C to perform selective etching to the substrate; a process of using 50-80 DEG C of alkaline stripping liquid to strip the resin pattern. The light-sensitive resin composition includes: alkaline soluble resin generated by reacting part of acid group come from acrylic resin containing acid group and epoxy group come from unsaturated compound containing alicyclic epoxy group; multifunctional monomer with more than three functions; and a photopolymerization initiator.

Description

technical field [0001] The present invention relates to a method for producing an etched substrate and a photosensitive resin composition. Background technique [0002] Plasma display panels (hereinafter abbreviated as "PDP") are widely used as large-screen full-color display devices. Since each pixel of the PDP emits light by itself to form an image, it has the advantages of wide viewing angle, fast response speed, and excellent color purity compared with liquid crystal displays that use backlight and color filters. [0003] Cr / Cu / Cr wiring in which a Cr (chromium) layer, a Cu (copper) layer, and a Cr layer are sequentially stacked on a glass substrate is known as one of wiring structures that supply power for light emission to each pixel of a PDP structure. Such a wiring structure is produced by forming a first Cr layer, a Cu layer, and a second Cr layer film sequentially by evaporation or sputtering to form a Cr / Cu / Cr laminated film, and then using a photolithography A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00G03F7/028
Inventor 高木利哉植松照博桃泽绫
Owner TOKYO OHKA KOGYO CO LTD
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