Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate

Abstract

A process for removal of undesirable conductive material (e.g., catalyst material and seeped circuit material) on a circuitized substrate and the resultant circuitized substrates disclosed. Such process and resultant circuit effectively address the electrical shorting problems caused by nonremoval of the residual catalyst material and circuit material which has seeped under the residual catalyst material. The process includes the steps of: a) providing a catalyst layer (e.g., palladium and tin) having circuit pattern (e.g., copper) thereon; b) pretreating the catalyst layer and the circuit pattern (e.g., with a cyanide dip) for removal of undesirable portions of each which cause electrical leakage between circuit lines of the circuit pattern; c) oxidizing the catalyst layer and the circuit pattern (e.g., with chlorite, permanganate, hydrogen peroxide, or air at a temperature elevated above ambient conditions); and d) removing the undesirable portions of the catalyst layer and the undesirable portions of the circuit pattern (e.g., with a cyanide submersion). The resultant circuitized substrate includes a circuit pattern on a catalyst layer wherein undesirable portions of the catalyst layer and circuit pattern are completely removed between the circuit features of the circuit pattern so that electrical leakage between the circuit features does not occur.

Description

1. Field of the InventionThe present invention relates generally to circuitized substrates and more specifically to a process for removal of undesirable conductive material (e.g., a catalyst layer) on a printed circuit and the resultant printed circuit.2. Description of the Related ArtIn the manufacture of printed circuit boards, a conductive circuit pattern is provided on at least one surface of a dielectric substrate. The circuit pattern can be formed on the substrate using a variety of known techniques. One of the better known techniques includes the electroless direct bond (EDB) technique, wherein copper is electrolessly plated directly onto the surface of the substrate in a desired pattern. The circuit pattern may include conductor lines on the surface of the substrate as well as in holes (often referred to as plated through holes) which connect one or more of the conductive layers together. Since the dielectric substrate is non-conductive, it is generally necessary to catalyze...

AI Technical Summary

Benefits of technology

It is a further object of the present invention to eliminate electrical shorting by completely removing residual catalyst and residual seeped circuit material.

It is a further object of the present invention to eliminate the need to scrap circuits due to shorting caused by the residual catalyst layer and residual seeped circuit material by completely removing the residual catalyst layer and residual seeped circuit material.

It is a further object of the present invention to increase product yield during processing of circuitized substrates thus resulting in a substantial cost benefit (on the order of over 1 million present value dollars industry wide).

It is a further object of the present invention to provide a process which has steps (e.g., pretreating residual material in cyanide, oxidizing, removing residual material in cyanide dip) to preferentially attack the residual catalyst layer and residual seeped circuit material without deleterious effects (e.g., excessive removal of circuit line material) to the surrounding circuit material and catalyst layer.

Problems solved by technology

One of the difficulties not adequately addressed heretofore occurs after the remaining resist has been removed, a residual catalyst layer (e.g., tin and palladium layer) remains between the circuit features (e.g. lines) of the circuit pattern.

Another difficulty is that when the catalyst layer has a circuit pattern deposited thereon, trace amounts of the circuit material (e.g., copper) in the circuit pattern, seep under the resist into the residual catalyst layer which causes further electrical shorting.

If the catalyst layer and residual circuit material are not adequately removed, electrical shorting between the circuit features of the finished circuit pattern occurs due to the residual catalyst material and residual seeped circuit material (e.g., copper).

This method, however, has not provided complete removal of the catalyst and seeped circuit material between the circuit features.

Heretofore, the related art does not disclose complete removal of the residual catalyst material and residual seeped circuit material.

If the residual catalyst layer and circuit material are not completely removed, they result in yield losses because of the shorts created.

Such a decrease in product yield becomes quite costly when processing large amounts of circuitized substrates.

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