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Adhesive with tunable porosity and methods to support temporary bonding applications

Inactive Publication Date: 2016-01-21
MOORE JOHN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent is about a mixture of binder and filler chemistry that forms an adhesive porous composite. When the composite is inserted and cured between a work unit and a rigid carrier substrate, it acts as a temporary adhesive with adjustable porosity. This allows liquid capillary penetration within the material which weakens adhesion and releases the work unit by separating the substrates without harm. The technical effect of this invention is to provide a versatile and effective temporary adhesive for manufacturing processes that allows for easy release of the work unit without causing damage.

Problems solved by technology

The removal aspect of these processes can pose serious challenges.
These and combinations of such practices prove a great hardship, complexity, and huge cost, for handling complex work units.

Method used

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  • Adhesive with tunable porosity and methods to support temporary bonding applications
  • Adhesive with tunable porosity and methods to support temporary bonding applications
  • Adhesive with tunable porosity and methods to support temporary bonding applications

Examples

Experimental program
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examples

[0040]The compositions of the invention and the method of demonstrating the examples are described. It is understood, however, that the invention is not meant to be limited to the details described therein. In the examples, the percentages provided are percent (%) by weight unless otherwise stated. The invention is further illustrated, without limitation, by the following examples. The measurement of performance and selectivity of the invention is conducted using practices readily accepted by the industry.

[0041]Coatings are produced on a Brewer Science, Inc. CB-100 spin-coater, while spray and encapsulation uses custom tooling designed at Daetec. Metrology data is generated by a XP-1 stylus profiler, AFP-200 atomic force profiler, and a Xi-100 optical profiler (www.kla-tencor.com), using equipment settings 5 mg stylus load, minimum 4 mm distance, and a speed of 0.5 mm / sec. Modified thermogravimetric test methodology for outgas is conducted by typical laboratory scales (+ / −0.1 mg). U...

example # 1

Example #1

[0043]The following experiments demonstrate the relationship of liquid penetration by capillary activity through an adhesive matrix prepared with a specific amount of binder and filler. Experiment #1 indicates the trend of faster penetration and release as thickness is reduced. Experiment #2 suggests improved penetration and release as the filler:binder ratio is increased. For both experiments, the polymer binder is a thermoplastic polyurethane (TPU), identified as Estane 5715 TPU, exhibiting a glass transition (Tg) and softening point of 23 C and 55 C, respectively, produced by Lubrizol Advanced Materials, Inc. (www.estane.com). The chosen filler for these experiments is a milled glass fiber identified as Microglass 3082, which includes fiber diameters and length of 16 um and 120 um, respectively, as manufactured by Fibertec (www.fibertecinc.com). Appearance of the milled glass is a powder. The TPU is dissolved into n,n-dimethylacetamide (DMAC) at approximately 25% solids...

example # 2

Example #2

[0045]A series of bonded glass pairs are prepared with a binder:filler ratio measured over a range between 0.4 and >2.0. Thickness of each adhesive composite is maintained constant at approximately 1.0 mm. The time to achieve full penetration and release of the bonded glass pair in AA7:DMSO is measured and reported in Table 2.

TABLE 2Penetration and release in AA7:DMSO of thebonded pair adhesive composite film prepared as binderEthane 5715 TPU with filler Microglass 3082, exhibitinga filler:binder ratio of 1.0. Thickness are varied as stated.Penetration &ThicknessFiller:Binderrelease time#(mm)ratio(sec)11.00.490021.01.030031.02.430

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Abstract

Compositions and methods are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 0.4, more preferably greater than 1.0, and most preferably greater than 2.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. Provisional Application No. 61 / 773,766, filed Mar. 6, 2013.FIELD OF THE INVENTION[0002]The present invention relates generally to a porous adhesive that is used to affix a work unit to hard and rigid carrier substrate and sufficiently holds the work unit in place to support several manufacturing steps whereby they are subsequently released within a short time period by liquid penetration without observable harm to the integrity of the work unit or carrier substrate. In particular, the porous adhesive comprises an adjustable mixture of binder and filler chemistry to affix a work unit to a carrier substrate such that it satisfies the physical, thermal, and chemical effects of a manufacturing process and subsequently allows easy and fast separation of the respective substrates by liquid capillary penetration without observable damage. The value and importance of a tunable adhesive for temporary bond...

Claims

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Application Information

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IPC IPC(8): C09J9/00H01L21/683H01L23/00
CPCC09J9/00H01L21/6835H01L2221/68318H01L24/98H01L24/27C08K3/013C09J5/00C09J11/04C09J11/08C09J2301/502H01L2221/68381B32B7/06B32B38/0032B32B38/10
Inventor MOORE, JOHN CLEAONPETTIT, JARED
Owner MOORE JOHN
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