Heat pipe heat dissipation structure

Abstract

A heat pipe heat dissipation structure includes a main body and at least one first capillary structure. The main body has a first inner side, a second inner side, a third inner side, a fourth inner side and at least one chamber filled with a working fluid. The first capillary structure is disposed in the chamber. The first capillary structure includes a first section disposed on the first inner side and a second section extending from two sides of the first section along the adjacent third and fourth inner sides. The first section has a thickness larger than that of the second section. The heat pipe heat dissipation structure has better heat transfer efficiency.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to a heat pipe heat dissipation structure, and more particularly to a heat pipe heat dissipation structure, which has better heat transfer efficiency and better anti-gravity ability and is able to reduce interface thermal resistance.[0003]2. Description of the Related Art[0004]There is a more and more obvious trend to miniaturization of all kinds of high-performance computers, intelligent electronic devices and other electrical equipments. To catch up this trend, the heat transfer components and heat dissipation components used in these devices have also been more and more miniaturized and thinned to meet the requirements of users.[0005]It is known that heat pipe is a heat transfer component with excellent thermal conductivity. The thermal conductivity of the heat pipe is several times to several tens times the thermal conductivity of copper, aluminum or the like. Therefore, the h...

AI Technical Summary

Benefits of technology

The present invention is a heat pipe heat dissipation structure that has better heat transfer efficiency, can handle higher thermal power, and has better anti-gravity ability. It includes a main body with inner sides and a chamber filled with a working fluid and a capillary structure consisting of a first section and a second section that extends along the inner sides of the main body. This structure allows the vapor working fluid to flow freely within the chamber, resulting in improved heat transfer and reduced pressure impedance. It also has better anti-gravity ability and can handle higher thermal power.

Problems solved by technology

However, this leads to another problem.

When compressing the flat-plate heat pipe, the capillary structure, (that is, the sintered metal powder or mesh capillary structure body) in the flat-plate heat pipe on two sides of the compressed faces is likely to be squeezed and damaged.

This will greatly deteriorate the heat transfer performance of the thin heat pipe or even make the thin heat pipe lose its function.

Moreover, although the flat-plate heat pipe can conduct the heat, after thinned and flattened, the internal capillary structure of the flat-plate heat pipe will have insufficient capillary attraction.

As a result, the anti-gravity thermal efficiency and heat transfer efficiency are poor.

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