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Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For Printed Wiring Board, And Printed Wiring Board

a technology of polyketone fiber paper and printed wiring board, which is applied in papermaking, non-fibrous pulp addition, plastic/resin/waxes insulators, etc., can solve the problems of reduced dimensional stability and strength, poor dimensional stability, and easy deformation of printed wiring boards, etc., to achieve excellent adhesiveness, high strength and modulus of elasticity, and excellent adhesiveness

Inactive Publication Date: 2008-05-08
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an aliphatic polyketone fiber paper with high strength and modulus of elasticity, excellent chemical resistance, heat resistance, dimensional stability, adhesiveness, and electrical insulation. The paper has low dielectricity and water absorbance, and is light, thin, porous, and uniform. The invention also provides a polyketone fiber paper core material for a printed wiring board with low dielectricity, excellent dimensional stability, and excellent electrical insulation. The printed wiring board comprises the polyketone fiber paper core material and a polymer resin. The technical effects of the invention are to provide a solution for the problems of prior art fiber papers and to provide a core material for a printed wiring board with excellent properties.

Problems solved by technology

However, it is necessary to improve heat resistance since polyester fibers are a thermoplastic resin and dimensional stability and strength are reduced by thermal expansion when exposed to a high temperature.
However, since aromatic polyamide fibers have high water absorbance, the printed wiring board substrates made from the aromatic polyamide fibers swell by desorption of the absorbed water during processing at a high temperature.
In multilayer printed wiring boards, slimming is difficult when the core material is thick.
If the core material is thin, printed wiring boards are easily deformed and have poor dimensional stability.
Also, when the core material has high water absorbance, there is trouble such as the occurrence of swelling and / or damage to the electrical insulation of the substrate when immersed in a molten solder bath.
Furthermore, when adhesion of the core material and the thermoplastic resin or thermosetting resin impregnated into or applied to the core material is bad, the impact resistance of the substrate is inferior.
Also, when a fiber paper comprising polyester fibers is used, the multilayer printed wiring board is easily deformed since the modulus of elasticity is low.
When a glass woven fabric or a glass nonwoven fabric is used, there are limitations in its application to uses desiring high frequency characteristics since the dielectric constant of glass is high.
However, a polyketone fiber paper core material and a printed wiring board using a polyketone fiber paper are still not on the market.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0074]100% by mass of aliphatic polyketone staple fibers with an average fiber diameter of 10 μm and fiber length of 3 mm were charged to a pulper, followed by the addition of water warmed to 50° C., to obtain a polyketone staple fiber water dispersion (fiber concentration: 2% by mass). The dispersion liquid was stirred for 15 minutes. Water was added to the dispersion liquid to make the fiber concentration 1% by mass. A defoamer (polyoxyalkylene glycol fatty acid ester) was added in an amount of 0.5% by mass of the amount of fibers, and the mixture was stirred for 30 minutes in a low-speed stirring vessel. Water was further added to the fiber dispersion liquid to adjust the slurry concentration to 0.1% by mass, followed by the addition of 20 ppm of a viscosity controlling agent (polyethylene oxide). The resulting slurry was deaerated under vacuum immediately before making paper using a cylinder paper machine equipped with a 100 mesh wire at a rate of 30 m / min. The wet paper thus pr...

examples 2 to 9

[0077]Polyketone fiber papers and polyketone fiber paper core materials for a printed wiring board were prepared in the same manner as in Example 1 using the aliphatic polyketone fibers shown in Table 2. Conditions differing from the conditions of Example 1 are described in Table 2. Printed wiring boards were prepared in the same manner as in Example 1 using the core materials.

example 10

[0078]Printed wiring boards were prepared in the same manner as in Example 1 by immersing the polyketone fiber paper core materials for a printed wiring board prepared in Example 1 in an epoxy resin solution (polyphenylene ether-based epoxy resin: 100 parts by mass, dicyandiamide curing agent: 3 parts by mass) with a solid component content of 45%.

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Abstract

An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 μm, a thickness of 5 to 200 μm, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN / kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin.—CH2—CH2—CO—  (1)

Description

TECHNICAL FIELD[0001]The present invention relates to a polyketone fiber paper which comprises 1 to 100% by mass of aliphatic polyketone fibers and which is obtained by a wet paper making process, a polyketone fiber paper core material for a printed wiring board, and a printed wiring board using the polyketone fiber paper core material.[0002]More particularly, the present invention relates to a polyketone fiber paper which comprises aliphatic polyketone fibers, which has high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness, and electrical insulation; and low dielectricity and water absorbance, and which is light, thin, and porous with uniform pores, a polyketone fiber paper core material for a printed wiring board, and a printed wiring board using the polyketone fiber paper core material.BACKGROUND ART[0003]In recent years, the manufacture of synthetic fiber paper using synthetic fibers instead of wood pulp has ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): D21H13/12D21H27/12
CPCD21H27/00D21H13/12
Inventor SHIRATORI, NAOYUKIHIGUCHI, MASAOMATSUSHITA, FUMIO
Owner ASAHI KASEI CHEM CORP
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