Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Abstract

A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical, assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

Description

CROSS REFERENCE TO CO-PENDING APPLICATIONS [0001] This is a divisional application of Ser. No. 11 / 031,074, filed Jan. 10, 2005.TECHNICAL FIELD [0002] The present invention relates to providing capacitors within circuitized substrates such as printed circuit boards, chip carriers and the like, and more specifically to a method for doing so and to products including such internal components as part thereof. Even more particularly, the invention relates to such methodologies and products wherein the capacitors are comprised of nano-powders. [0003] In Ser. No. 11 / 031,085, entitled “Capacitor Material For Use In Circuitized Substrates, Circuitized Substrate Utilizing Same, Method of Making Said Circuitized Substrate, And Information Handling System Utilizing Said Circuitized Substrate”, also filed Jan. 10, 2005 (inventors: J. Lauffer et al), there is defined a material for use as part of an internal capacitor within a circuitized substrate wherein the material includes a polymer resin an...

AI Technical Summary

Benefits of technology

This approach enables the creation of substrates with enhanced capacitance density and miniaturized circuit patterns, reducing the need for external components and improving the substrate's ability to handle high-frequency signals without impedance disruption, while being cost-effective and compatible with conventional PCB manufacturing processes.

Problems solved by technology

The discrete passive devices occupy a high percentage of the surface area of the completed substrate, which is undesirable from a future design aspect because of the increased need and demand for miniaturization in today's substrates and products containing same art.

Some of the patents listed below, particularly U.S. Pat. No. 5,162,977, mention use of various materials for providing desired capacitance levels under this formula, and many mention or suggest problems associated with the methods and resulting materials used to do so.

Use of pre-fired and ground ceramic nano-powders in the dielectric layer poses obstacles for the formation of thru-holes (conductive holes permitting electronic communication between conductive layers of a PCB), however.

The distribution within the dielectric layer of particles of different size often presents major obstacles to thru-hole formation where the thru-holes are of extremely small diameter, also referred to in the industry as micro-vias due to the presence of the larger particles.

Another problem associated with pre-fired ceramic nano-powders is the ability for the dielectric layer to withstand substantial voltage without breakdown occurring across the layer.

This is even further undesirable because, as indicated by the equation cited above, greater planar capacitance may also be achieved by reducing the thickness of the dielectric layer.

That is, the resulting PCB still requires the utilization of external devices thereon, and thus does not afford the PCB external surface area real estate savings mentioned above which are desired and demanded in today's technology.

Although the pre-fired and ground dielectric formulations produced by solid phase reactions are acceptable for many electrical applications, these suffer from several disadvantages.

First, the milling step serves as a source of contaminants, which can adversely affect electrical properties.

Second, the milled product consists of irregularly shaped fractured aggregates which are often too large in size and possess a wide particle size distribution, 500-20,000 nm.

Consequently, films produced using these powders are limited to thicknesses greater than the size of the largest particle.

Thirdly, powder suspensions or composites produced using pre-fired ground ceramic powders must be used immediately after dispersion, due to the high sedimentation rates associated with large particles.

It is thus clear that methods of making PCBs which rely on the advantageous features of using nano-powders as part of the PCB's internal components or the like, such as those described in selected ones of the above patents, possess various undesirable aspects which are detrimental to providing a PCB with optimal functioning capabilities when it comes to internal capacitance or other electrical operation.

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