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Photosensitive resin composition for photosensitive clearance material

A technology of photosensitive resin and composition, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment, and can solve problems such as insufficient plastic deformation

Active Publication Date: 2007-01-31
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a photogap material is formed using the photosensitive resin composition for a photogap material disclosed in JP-A-2003-302639, there is a problem that the amount of plastic deformation is insufficient.

Method used

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  • Photosensitive resin composition for photosensitive clearance material
  • Photosensitive resin composition for photosensitive clearance material
  • Photosensitive resin composition for photosensitive clearance material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、2 and comparative example 1

[0161] The structure, molar ratio, etc. of the binder resin Aa used in Example 1 are shown in formula (X) and Table 1. In Table 1, a to d represent molar ratios.

[0162]

[0163] Description of constituent units

[0164] a: Structural unit introduced from (A2) in copolymer 1.

[0165] b: Structural unit introduced from (A2) in copolymer 1.

[0166] c: A structural unit introduced by reacting (A3) to the structural unit introduced from (A4) in the copolymer 1.

[0167] d: A structural unit introduced by reacting (A5) at a site derived from (A3) in copolymer 2.

[0168] Resin Aa

a

0.25

b

0.25

c

0.15

d

0.35

R1

H

mw

18000

Mw / Mn

2.2

[0169] The polystyrene conversion weight average molecular weight (Mw) and the number average molecular weight (Mn) of the said binder polymer were measured by the GPC method under the following conditions.

[0170] Device: H...

Embodiment 3、 comparative example 2

[0207] Embodiment 3, comparative example 2, comparative example 3

[0208] In Example 3, Comparative Example 2, and Comparative Example 3, the structure Ab, composition, etc. of the resin used as the binder resin (A) are shown in Formula (Y) and Table 4. In Table 4, a to d represent molar ratios.

[0209] Using the compositions shown in Table 5, evaluation was performed in the same manner as in Example 1. The results are shown in Table 6.

[0210]

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PUM

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Abstract

A photosensitive resin composition for photosensitive clearance material comprises a resin binder (A), a photo-polymerization compound (B), a photo-polymerization initiator (C) and a solvent (D), the photo-polymerization compound (B) contains a compound of the formula (I) with a content of 5-60 w% in a total amount of resin binder, photo-polymerization compound (B) and photo-polymerization initiator (C). In formula (I), R1-R6 are separately represent H or any group of formula (I-1) to (I-3), at least four groups of R1-R6 are selected from the groups of (I-1) to (I-3) and at least one group of R1-R6 is selected from the groups of (I-2) to (I-3).

Description

technical field [0001] The invention relates to a photosensitive resin composition for a photosensitive gap material. Background technique [0002] A gap material is provided between a color filter and an array substrate constituting a display device such as a liquid crystal display device or a touch panel in order to maintain a gap between the two substrates. As this gap material, instead of the conventional method of dispersing spherical particles, a photosensitive gap material method in which a photosensitive resin composition is used to form a gap material has been proposed. [0003] A photosensitive resin composition used in the photogap material method has been proposed in the literature to contain methacrylic acid / allyl methacrylate copolymer as a binder resin and dipentaerythritol hexaacrylate as a photopolymerizable compound. Photosensitive resin composition for photosensitive gap material (see JP-A-2003-302639). [0004] However, when a photogap material is forme...

Claims

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Application Information

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IPC IPC(8): G03F7/004G02F1/1339
CPCG03F7/0045G03F7/027G03F7/032
Inventor 武部和男
Owner SUMITOMO CHEM CO LTD
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