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Negative light-sensitive resin composition

A technology of photosensitive resin and composition, applied in optics, opto-mechanical equipment, nonlinear optics, etc., can solve the problems of volume shrinkage, slow curing speed, difficult to achieve high transmittance of interlayer insulating film, etc., and achieve excellent performance , The effect of improving sensitivity, residual film rate, and excellent UV transmittance

Active Publication Date: 2011-04-27
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using the above-mentioned acrylic resin, there is a problem that it is colored after thermosetting and it is difficult to achieve the high transmittance required for the interlayer insulating film.
[0006] Acrylic is mainly used for resist resins for protective layers, resist resins for black matrix matrices, resist resins for column spacers, and resist resins for color filters that have conventionally been used as materials for liquid crystal elements for image formation. Resins, these acrylic resins have the following problems: the curing speed determined by the photoinitiator and the polyfunctional monomer having an ethylenically unsaturated bond is slow, and volume shrinkage occurs after curing

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0065] (manufacture of acrylic copolymer)

[0066] Add 10 parts by weight of 2,2-azobis(2,4-dimethylvaleronitrile), 200 parts by weight of propylene glycol monomethyl ether acetate, 10 parts by weight Parts of methacrylic acid, 25 parts by weight of glycidyl methacrylate, 35 parts by weight of allyl methacrylate of the following chemical formula 1a, and 30 parts by weight of styrene were nitrogen exchanged and then slowly stirred. The temperature of the reaction solution was raised to 62° C. and maintained at this temperature for 5 hours to produce a polymer solution containing an acrylic copolymer.

[0067] The acrylic copolymer produced as above was added dropwise to 5000 parts by weight of hexane, separated by filtration, and then 200 parts by weight of propionate was added thereto, heated to 30°C, and the concentration of the solid content was: 45% by weight, a polymer solution having a polymer weight average molecular weight of 11,000. In this case, the weight average m...

Embodiment 2

[0073] In the manufacture of the acrylic copolymer of the above-mentioned embodiment 1, using 15 parts by weight of glycidyl methacrylate and 45 parts by weight of allyl methacrylate of the chemical formula 1a, the solid of the manufactured acrylic copolymer Except that the density|concentration of a component is 45 weight%, and a weight average molecular weight is 13000, it implemented by the method similar to said Example 1, and manufactured the negative photosensitive resin composition coating solution.

Embodiment 3

[0075] In the manufacture of the acrylic copolymer of the above-mentioned Example 1, 65 parts by weight of allyl methacrylate of chemical formula 1a, 5 parts by weight of methacrylic acid, 5 parts by weight of glycidyl methacrylate, 25 parts by weight styrene by weight to make a polymer solution, add 250 parts by weight of propionate to make a solid concentration of 45% by weight and an acrylic copolymer with a weight-average molecular weight of 15000, in addition, through the above-mentioned The same method as in Example 1 was carried out to manufacture a negative photosensitive resin composition coating solution.

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Abstract

The invention provides the negativity light-sensitive resin compound. It has good adhesive force, heat-durability, insulativity, chemical resistance, high sensibility and UV transmissivity, so it can be used in image forming material and organic insulation film. The resin comprises acrylic polymers, light initiating agent, polyfunctional monomer with unsaturated link, siliconium compound with epoxy radicals or amidogen and solvent. The acrylic polymers are made by polymerizing allylation acyclic compound, unsaturated carboxylic acid, unsaturated carboxyanhydride, unsaturated compounds with epoxy radicals and olefin compound.

Description

technical field [0001] The present invention relates to a negative photosensitive resin composition, more specifically, the present invention relates to the following negative photosensitive resin composition, the negative photosensitive resin composition adhesion, heat resistance, insulation, flatness, Excellent chemical resistance and other properties, suitable for image forming materials for liquid crystal display elements, especially, because of excellent sensitivity, residual film rate, and UV transmittance when forming organic insulating films of liquid crystal display elements, it is suitable for use as interlayer organic insulating film; not only that, the negative photosensitive resin composition is used as a resist resin for a protective layer, a resist resin for a black matrix matrix, a resist resin for a column spacer or When resist resin is used for color filters, sensitivity and residual film rate can be improved. Background technique [0002] In TFT-type liqu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/038G03F7/027G02F1/136G02F1/1333
CPCC07C59/285C08G77/16G03F7/0007G03F7/0233G03F7/027G03F7/032G03F7/033G03F7/0382
Inventor 尹柱豹金柄郁尹赫敏丘冀赫吕泰勳郑义澈金东明崔相角李浩真申洪大李东赫
Owner DONGJIN SEMICHEM CO LTD
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