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Method for producing flexible metal foil-polyimide laminate

A technology of polyimide layer and flexible metal, which is applied in the field of preparation of flexible metal foil/polyimide laminates, and can solve the problems of thickness variation and excessive thickness variation

Inactive Publication Date: 2006-03-29
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since it is difficult to apply a uniform thickness, variations in thickness often occur, resulting in defective products
This shows the tendency that when the solution is applied in fractional steps, the variation in thickness becomes too large as the number of separate steps increases

Method used

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  • Method for producing flexible metal foil-polyimide laminate
  • Method for producing flexible metal foil-polyimide laminate

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Effect test

preparation example Construction

[0043] The adhesive used in the production method of the present invention basically means that the degree of imidization in the lamination stage is less than 5%, more preferably less than 3%, even more preferably less than 1%, and the softening point is at most due to the inclusion of solvents 150°C, more preferably 80-150°C, even more preferably 80-120°C polyamic acid. A polyamic acid is obtained by reacting an aromatic diamine with an aromatic tetracarboxylic anhydride in a polar solvent, and the reaction solution can be used in a binder used as a varnish without further treatment.

[0044] The polyamic acid used here is obtained by condensation reaction of aromatic tetracarboxylic acid anhydride with aromatic diamine and as described above, it is preferably selected from the condensation products of pyromellitic anhydride and 4,4'-diaminodiphenyl ether, Condensate of 3,4,3',4'-biphenyltetracarboxylic anhydride and p-phenylenediamine, and mixtures thereof. For this reason,...

Embodiment 1

[0058] Synthesis of polyamic acid

[0059] 218.5 g of pyromellitic anhydride was added to 1 kg of N,N-dimethylacetamide, stirred in a nitrogen atmosphere and maintained at 10°C. 200.5 g of 4,4'-diaminodiphenyl ether in 1 kg of N,N-dimethylacetamide are added slowly so that the internal temperature does not exceed 15°C. The reaction was then carried out at 10-15°C for 2 hours and continued at room temperature for another 6 hours. At the end of the reaction, the logarithmic viscosity was measured to be 0.8 dl / g (measured at a concentration of 0.5 g / dl and 30° C. using an Ubbelohde viscometer).

[0060] Laminate Preparation

[0061] The polyamic acid varnish prepared above was coated to a liquid accumulation thickness of 60 microns on a 35 micron rolled copper foil cut into 30 m×25 cm by means of an applicator, and dried in an oven at 120° C. for 5 minutes. The residual solvent content of the polyamic acid layer was 5% by weight, the degree of imidization was 3%, and the softe...

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Abstract

A method for producing a flexible metal foil-polyimide laminate is characterized in that after bonding a metal foil and a polyimide film via a heat-resistant adhesive by hot roll pressing, the remaining solvent in the adhesive layer is removed and the adhesive is heat-cured by a heat treatment.

Description

technical field [0001] The present invention relates to the preparation of flexible metal foil / polyimide laminates for use in electronic components such as circuit boards. Background technique [0002] It is known in the art to manufacture flexible substrates by directly applying a polyimide precursor resin solution on a conductor, followed by drying and curing, as for example in JP-A 59-232455, JP-A 61-275325, JP-A 62- 212140 and JP-A 7-57540. Another method of applying a polyimide precursor resin solution on a conductor in fractional steps is disclosed in, for example, JP-A 2-180682, JP-A 2-180679, JP-A 1-245586 and JP-A 2-122697. [0003] However, a problem with the method of applying a polyimide precursor resin solution on a conductor is that unless the thickness of the final polyimide layer on a flexible substrate is at least 20 micrometers, it will suffer from the lack of so-called "body feeling". )” resulting in difficult substrate handling. This necessarily entail...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/48B32B15/08H01L21/60B29L9/00B32B15/088B32B27/34C09J5/06H05K1/03H05K3/00H05K3/22H05K3/38
CPCB32B27/34B32B2250/40B32B2255/26B32B2307/306B32B2311/00B32B7/12C09J2479/086B32B2379/08H05K3/227B32B2255/06H05K2203/1105C09J5/06H05K1/0346B32B15/20B32B2457/08B32B15/08C09J2400/163B32B37/1207B32B2307/714H05K3/386B32B2307/3065B32B27/281B29C65/52B32B37/06
Inventor 薄雅浩相泽道生星田繁宏天野正
Owner SHIN ETSU CHEM IND CO LTD
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