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Copper alloy material for integrated circuit lead frame and manufacturing process thereof

A lead frame, integrated circuit technology, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of low elongation rate and tensile strength above 390MP

Inactive Publication Date: 2005-08-17
SHANGHAI JINTAI COPPER IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the technical problems that the tensile strength of the existing pure copper material for integrated circuit lead frame cannot reach more than 390 MP, and the elongation rate is not high, and provides a material for integrated circuit lead frame with better mechanical properties and its manufacturing process

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Process flow of the present invention is:

[0013] Raw material inspection——→weighing ingredients—→melting into the furnace—→transfer to holding furnace——→sampling and analysis——→semi-continuous casting—→cutting head and tail of ingot—→ingot quality inspection—→step Furnace heating—→hot rolling—→strip milling—→strip quality inspection—→cold rough rolling—→edge trimming—→bell furnace annealing—→cold rolling (bell furnace Annealing——→Cold rolling)——→Intermediate annealing in air cushion furnace——→12-high finish rolling——→Cleaning of finished product in air cushion furnace (degreasing, annealing, pickling, cleaning, passivation, drying)——→Pull Bending straightening—→finished product inspection—→packing and storage.

[0014] The present invention does not adopt the production process of horizontal continuous casting and cold rolling of long strip blanks, but adopts vertical semi-continuous casting of large ingots, and carries out strip blank milling after heating and hot r...

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PUM

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Abstract

The copper alloy material for integrated circuit lead frame consists of: Cu not less than 99.8 wt%, Fe 0.05-0.15 wt% and P 0.015-0.05 wt%. Its production process includes material inspection, weighing and compounding, smelting, semi-continuous casting, hot rolling, milling belt blank, cold initial rolling, cutting edges, annealing, cold intermediate rolling, intermediate annealing, 12 roller final rolling, cleaning, straightening, packing and other steps. It has tensile strength up to 390 MPa, high stretch rate and raised heat resisting performance.

Description

【Technical field】 [0001] The invention relates to a copper alloy material, in particular to a copper alloy material for an integrated circuit lead frame and a manufacturing process thereof. 【Background technique】 [0002] An integrated circuit consists of three parts: a chip, a lead frame and a plastic package. The function of the lead frame is to support the chip (silicon chip), dissipate heat generated during work, and connect to external circuits. It is an extremely critical component in the integrated circuit; with the integration Circuits (IC) are rapidly developing towards large-scale integrated circuits (LSI) and ultra-large-scale (ULSI), and the lines are highly integrated and high-density. Lead frames are also developing in the direction of short, small, light, and thin. A series of comprehensive properties such as strength, high electrical conductivity, high thermal conductivity, good weldability, corrosion resistance, plastic sealing, oxidation resistance, stampin...

Claims

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Application Information

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IPC IPC(8): C22C9/00H01L21/58H01L23/00
CPCH01L24/45H01L2224/43848H01L24/43H01L2224/45147H01L2224/43H01L2224/45H01L2924/01322H01L2924/14H01L2924/01026H01L2924/01015H01L2924/01202H01L2924/013H01L2924/00H01L2924/20111H01L2924/00012
Inventor 方守谊
Owner SHANGHAI JINTAI COPPER IND
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