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Device and method for pretreating waste gas under moisture environment

A pretreatment, wet environment technology, applied in chemical instruments and methods, combined devices, separation methods, etc., can solve problems such as exhaust fans increasing the manufacturing cost of exhaust gas treatment systems

Inactive Publication Date: 2003-12-03
UNISEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of exhaust fans increases the manufacturing cost of the exhaust gas treatment system

Method used

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  • Device and method for pretreating waste gas under moisture environment
  • Device and method for pretreating waste gas under moisture environment
  • Device and method for pretreating waste gas under moisture environment

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Embodiment Construction

[0025] Referring to FIG. 1 , the wet pretreatment device 10 of the present invention includes a treatment section 20 and an atomizing nozzle 15 , and the treatment section 20 pretreats the exhaust gas by using the cyclone effect. The wet pretreatment device 10 that the present invention builds has waste gas inlet 11, reagent inlet 12, is used to discharge the waste gas outlet 21 of the waste gas through wet pretreatment, and the waste liquid outlet 31 that is used to discharge waste water, and described waste water comprises from described Fine powder and water-soluble components are removed from the exhaust gas.

[0026]The treatment section 20 of the wet pretreatment device 10 utilizes the cyclone effect, where the centrifugal force of a rotating fluid separates solid particles or liquid droplets dispersed in said fluid. By spraying the reagent into the exhaust gas stream in a rotating motion in the treatment section 20, water-soluble components and fines in the exhaust gas ...

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Abstract

An apparatus and method for wet pre-treatment of an effluent gas derived from upstream semiconductor or LCD manufacturing tools before the effluent gas is processed in an effluent gas treatment system in provided. The apparatus comprises an atomizing spray nozzle for atomizing a reagent and a processing section in which the effluent gas in pre-treated with the atomized reagent using a cyclone method. The processing section comprises an inner tubular portion and an outer tubular portion. The processing section has an effluent gas inlet, a reagent inlet, an effluent gas outlet, and a waste liquid outlet. An apparatus is also provided which includes a plurality of wet pre-treatment units, each of which pre-treat each of effluent gas streams derived from a plurality of CVD chambers.

Description

field of invention [0001] The present invention relates to waste gas treatment, and more particularly to an apparatus and method for pre-treating waste gas from semiconductor or LCD device manufacturing processes in a wet environment. Background of the invention [0002] In the semiconductor or LCD device manufacturing process, such as low-pressure chemical vapor deposition, plasma-enhanced chemical vapor deposition and plasma etching, the exhaust gas may contain toxic, corrosive or explosive gases, such as silane SiH4, arsine AsH3 , phosphine trihydrogen PH3, diborane B2H6, tetraethoxysilane (TEOS) Si (OC 2 h 5 ) 4 , ammonia NH 3 , boron trichloride BCl 3 , Chlorine Cl 2 , sulfur hexafluoride SF 6 , Hexafluoroethane C 2 f 6 and carbon tetrafluoride CF 4 . Therefore, the off-gases generated during these preparations must be properly treated before being released into the atmosphere. [0003] In particular, perfluorinated compound (herein referred to as "PFC") gase...

Claims

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Application Information

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IPC IPC(8): H01L21/02B01D53/18
CPCB01D53/18H01L21/02
Inventor 李炳一任炳权吴闰学郑成珍李万洙郑枪旭尹泰爽李根植
Owner UNISEM
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